TRCV0110G LSI, TRCV0110G Datasheet - Page 2

• Manufacturer Part Number: TRCV0110G
• Manufacturer: LSI

Specifications of TRCV0110G

• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3.13V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

Contents
Clock Recovery, 1:16 Data Demultiplexer
Features .................................................................................................................................................................... 1
Applications ............................................................................................................................................................... 1
Description.................................................................................................................................................................1
Ball Information..........................................................................................................................................................4
Functional Overview ................................................................................................................................................11
FEC Rate Support ...................................................................................................................................................11
High-Speed Data Inputs ..........................................................................................................................................11
Clock Recovery Operation.......................................................................................................................................12
CDR Input Jitter Tolerance ......................................................................................................................................13
Lock Detect..............................................................................................................................................................14
Demultiplexer Operation..........................................................................................................................................15
Absolute Maximum Ratings.....................................................................................................................................16
Handling Precautions ..............................................................................................................................................16
Recommended Operating Conditions .....................................................................................................................16
Electrical Characteristics .........................................................................................................................................17
Timing Characteristics .............................................................................................................................................19
Packaging Characteristics .......................................................................................................................................22
Ordering Information................................................................................................................................................29
2
Block Diagram......................................................................................................................................................... 3
Package Diagram ................................................................................................................................................... 4
Ball Assignments ....................................................................................................................................................5
Ball Description ....................................................................................................................................................... 7
Limiting Amplifier Operation..................................................................................................................................11
Loopback Data Input.............................................................................................................................................12
Demultiplexer Data Mute (MUTEDMXN) ..............................................................................................................15
CK622P/N Output Mute (MUTE622N) ..................................................................................................................15
CKOP/N Output Frequency Select (FREQCKO) ..................................................................................................15
CKOP/N Output Mute (MUTECKON) ...................................................................................................................15
Reset (RESETN)...................................................................................................................................................15
LVDS, CMOS, and CML Input and Output Pins ...................................................................................................17
Output Timing .......................................................................................................................................................19
Output Timing .......................................................................................................................................................20
Reference Frequency (REFCLKP/N, REFFREQ) (Standard SONET Rate).........................................................21
Reference Frequency (REFCLKP/N, REFFREQ) (FEC Rate) .............................................................................21
Reference Frequency (REFCLKP/N, REFFREQ) (Ethernet Rate) .......................................................................21
CBGA (Ceramic Ball Grid Array) Package Information.........................................................................................22
CBGA PWB Design Information ...........................................................................................................................22
CBGA Assembly Information ................................................................................................................................23
CBGA Suggested Underfill Process .....................................................................................................................24
CBGA Reference Materials...................................................................................................................................24
Package Diagram—177-Ball CBGA (Bottom View) ..............................................................................................25
FSBGA1 Package Information ..............................................................................................................................26
FSBGA1 PWB Design Information .......................................................................................................................26
FSBGA1 Assembly Information ............................................................................................................................26
FSBGA1 Reference Materials...............................................................................................................................27
Package Diagram—177-Ball FSBGA1 (Bottom View) ..........................................................................................28
Table of Contents
Agere Systems Inc.
June 7, 2002
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