TRCV0110G LSI, TRCV0110G Datasheet - Page 23

• Manufacturer Part Number: TRCV0110G
• Manufacturer: LSI

Specifications of TRCV0110G

• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3.13V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

June 7, 2002
Agere Systems Inc.
Packaging Characteristics
CBGA Assembly Information
Note: Each assembly process will have its own idiosyncrasies, due to product design, materials differences, and
It is recommended that the stencil thickness be set at 0.006 in. for a starting point. After trials with the recom-
mended stencil opening size, stencil thickness, and process-specific solder paste, a visual inspection should be
done to ensure a proper fillet and wetting is obtained for each ball. The reflowed solder fillet should resemble a
cylindrical column from the PWB to the center of the ball. In addition to the recommended CBGA assembly proce-
dure, Underfill is highly recommended to decrease the chances of cracking in the solder joint between the CBGA
device ball and the PCB. Please see Suggested Underfill Process.
The reflow profile should be determined using a known setpoint for the oven such as the Joint Electron Device
Engineering Council (JEDEC) profile. The JEDEC profile is defined as the following parameters.
Table 19. JEDEC Profile
Belt speed = 28 in./min.
A representative sample of the product (fitted with multiple thermocouples and a data logger) should be run
through the oven to determine the optimum profile. The temperature of the CBGA device should not exceed
225 °C, and only be above the liquidus of the solder alloy (typically 180 °C) for less than 60 s.
equipment variations. Assembly information provided here is a beginning point from which the assembly
process engineer should apply their knowledge and experience to obtain optimal results.
1
2
3
4
5
6
7
ZONE
Upper
Lower
Upper
Lower
Upper
Lower
Upper
Lower
Upper
Lower
Upper
Lower
Upper
Lower
(continued)
Temp
140
140
150
150
150
150
180
180
180
180
205
205
245
245
Clock Recovery, 1:16 Data Demultiplexer
Unit
C
C
C
C
C
C
C
C
C
C
C
C
C
C
23