UJA1069TW24/3V3-T NXP Semiconductors, UJA1069TW24/3V3-T Datasheet - Page 59
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
UJA1069TW24/3V3-T
Manufacturer Part Number
UJA1069TW24/3V3-T
Description
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1069TW243V3-T.pdf
(64 pages)
Specifications of UJA1069TW24/3V3-T
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
24
Lead Free Status / RoHS Status
Compliant
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NXP Semiconductors
Fig 28. Package outline SOT864-1 (HTSSOP24)
UJA1069_4
Product data sheet
HTSSOP24: plastic thermal enhanced thin shrink small outline package; 24 leads;
body width 4.4 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
SOT864-1
VERSION
OUTLINE
Z
max
1.1
A
24
1
0.15
0.05
y
A
1
0.95
0.80
A
2
pin 1 index
0.25
IEC
e
A
3
exposed die pad
0.30
0.19
b
p
D
D
H
0.2
0.1
c
MO-153
JEDEC
D
7.9
7.7
(1)
b
REFERENCES
p
D
4.3
4.1
0
h
Rev. 04 — 28 October 2009
E
4.5
4.3
w
(2)
13
12
M
JEITA
3.3
3.1
E
E
h
scale
h
2.5
0.65
e
c
6.6
6.2
H
E
A
2
A
1
L
1
5 mm
detail X
0.75
0.50
L
p
0.2
v
LIN fail-safe system basis chip
H
E
PROJECTION
E
EUROPEAN
0.13
w
L
0.1
y
L
p
0.5
0.2
Z
UJA1069
© NXP B.V. 2009. All rights reserved.
(A
A
3
)
8
0
ISSUE DATE
04-09-23
05-12-06
X
A
v
SOT864-1
M
59 of 64
A
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