SC16C850VIBS-S NXP Semiconductors, SC16C850VIBS-S Datasheet - Page 43
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SC16C850VIBS-S
Manufacturer Part Number
SC16C850VIBS-S
Description
Manufacturer
NXP Semiconductors
Datasheet
1.SC16C850VIBS-S.pdf
(48 pages)
Specifications of SC16C850VIBS-S
Transmitter And Receiver Fifo Counter
Yes
Data Rate
5Mbps
Mounting
Surface Mount
Pin Count
32
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Number Of Channels
1
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
SC16C850V
Product data sheet
12.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 38.
Table 39.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 38
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Single UART with 128-byte FIFOs, IrDA, and XScale VLIO bus interface
Figure
All information provided in this document is subject to legal disclaimers.
39
16.
Rev. 5 — 19 January 2011
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
16) than a SnPb process, thus
≥ 350
220
220
SC16C850V
245
> 2000
260
245
© NXP B.V. 2011. All rights reserved.
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