SAF7118EHV1 NXP Semiconductors, SAF7118EHV1 Datasheet - Page 160
SAF7118EHV1
Manufacturer Part Number
SAF7118EHV1
Description
Manufacturer
NXP Semiconductors
Datasheet
1.SAF7118EHV1.pdf
(175 pages)
Specifications of SAF7118EHV1
Screening Level
Industrial
Package Type
HBGA
Pin Count
156
Lead Free Status / RoHS Status
Compliant
- Current page: 160 of 175
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NXP Semiconductors
17. Package outline
Fig 96. Package outline SOT807-1 (HBGA156)
SAF7118_4
Product data sheet
HBGA156: plastic thermal enhanced ball grid array package; 156 balls;
body 15 x 15 x 1.15 mm; heatsink
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT807-1
ball A1
index area
shape
optional (4
max.
1.75
A
P
N
M
L
K
J
H
G
F
E
D
C
B
A
A 1
0.5
0.3
1
1.25
1.05
A 2
2
3
IEC
4
0.6
0.4
e
b
5
6
15.2
14.8
7
D
D 1
e 1
D
8
1/2
9
13.2
12.8
D 1
10
e
MS-034
JEDEC
11
15.2
14.8
12
E
b
REFERENCES
13
0
14
13.2
12.8
Rev. 04 — 4 July 2008
E 1
1/2
B
e
j E 1 E
e
1
e
JEITA
Multistandard video decoder with adaptive comb filter
scale
w
v
e 2
5
M
M
A
e 1
13
C
C
A
13
e 2
B
10 mm
10
8
j
A
heatsink
0.3
v
A 2
y 1 C
A 1
0.1
w
PROJECTION
EUROPEAN
0.15
detail X
y
0.35
y 1
X
C
y
SAF7118
© NXP B.V. 2008. All rights reserved.
ISSUE DATE
03-03-06
SOT807-1
160 of 175
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