STAC9766XXTAEC1X IDT, Integrated Device Technology Inc, STAC9766XXTAEC1X Datasheet - Page 92
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STAC9766XXTAEC1X
Manufacturer Part Number
STAC9766XXTAEC1X
Description
Manufacturer
IDT, Integrated Device Technology Inc
Datasheet
1.STAC9766XXTAEC1X.pdf
(97 pages)
Specifications of STAC9766XXTAEC1X
Single Supply Voltage (typ)
3.3/5V
Single Supply Voltage (min)
3.135/4.75V
Single Supply Voltage (max)
3.465/5.25V
Package Type
TQFP
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STAC9766XXTAEC1X
Manufacturer:
SIGMATEL
Quantity:
20 000
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15.SOLDER REFLOW PROFILE
IDT™
TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH STEREO MICROPHONE AND MIC/JACK SENSING
STAC9766/9767
TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH STEREO MICROPHONE AND MIC/JACK SENSING
Time maintained above
15.1. Standard Reflow Profile Data
Time within 5
Note: These devices can be hand soldered at 360
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount
Devices” (www.jedec.org/download).
Note: All temperatures refer to topside of the package, measured on the package body surface.
Peak / Classification Temperature (Tp)
Average Ramp-Up Rate (Ts
Preheat
o
Profile Feature
C of actual Peak Temperature (tp)
Time 25
Temperature Min (Ts
o
C to Peak Temperature
Time (ts
Temperature Max
Temperature (T
Ramp-Down rate
min
Figure 26. Solder Reflow Profile
max
Time (t
(Ts
- ts
- Tp)
max
max
min
L
L
o
C for 3 to 5 seconds.
)
)
)
)
)
3
150
200
60 - 180 seconds
217
60 - 150 seconds
See “Package Classification Reflow Temperatures”
on page 93.
20 - 40 seconds
6
8 minutes max
o
o
C / second max
C / second max
92
o
o
o
C
C
C
Pb Free Assembly
STAC9766/9767
PC AUDIO
V 7.4 12/06
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