STAC9766XXTAEC1X IDT, Integrated Device Technology Inc, STAC9766XXTAEC1X Datasheet - Page 92

• Manufacturer Part Number: STAC9766XXTAEC1X
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of STAC9766XXTAEC1X

• Single Supply Voltage (typ): 3.3/5V
• Single Supply Voltage (min): 3.135/4.75V
• Single Supply Voltage (max): 3.465/5.25V
• Package Type: TQFP
• Lead Free Status / RoHS Status: Compliant

15.SOLDER REFLOW PROFILE
IDT™
TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH STEREO MICROPHONE AND MIC/JACK SENSING
STAC9766/9767
TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH STEREO MICROPHONE AND MIC/JACK SENSING
Time maintained above
15.1. Standard Reflow Profile Data
Time within 5
Note: These devices can be hand soldered at 360
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount
Devices” (www.jedec.org/download).
Note: All temperatures refer to topside of the package, measured on the package body surface.
Peak / Classification Temperature (Tp)
Average Ramp-Up Rate (Ts
Preheat
o
Profile Feature
C of actual Peak Temperature (tp)
Time 25
Temperature Min (Ts
o
C to Peak Temperature
Time (ts
Temperature Max
Temperature (T
Ramp-Down rate
min
Figure 26. Solder Reflow Profile
max
Time (t
(Ts
- ts
- Tp)
max
max
min
L
L
o
C for 3 to 5 seconds.
)
)
)
)
)
3
150
200
60 - 180 seconds
217
60 - 150 seconds
See “Package Classification Reflow Temperatures”
on page 93.
20 - 40 seconds
6
8 minutes max
o
o
C / second max
C / second max
92
o
o
o
C
C
C
Pb Free Assembly
STAC9766/9767
PC AUDIO
V 7.4 12/06