USB3300-EZK Standard Microsystems (SMSC), USB3300-EZK Datasheet - Page 6

• Manufacturer Part Number: USB3300-EZK
• Manufacturer: Standard Microsystems (SMSC)

Specifications of USB3300-EZK

• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: QFN
• Rad Hardened: No
• Lead Free Status / RoHS Status: Compliant

Pin Configuration and Pin Definitions
Revision 1.08 (11-07-07)
USB3300 Pin Locations
Pin Definitions, 32-Pin QFN Package
PIN
1
2
3
4
The USB3300 is offered in a 32 pin QFN package (5 x 5 x 0.9mm). The pin definitions and locations
are documented below.
The exposed flag of the QFN package must be connected to ground with a via array to the ground
plane. This is the main ground connection for the USB3300.
NAME
CPEN
VBUS
GND
GND
VDD3.3
CPEN
VBUS
GND
GND
DM
DP
ID
DIRECTION,
Ground
Ground
Output,
Analog
CMOS
1
2
3
4
5
6
7
8
TYPE
Figure 4 USB3300 Pinout - Top View
I/O,
Table 1 USB3300 Pin Definitions
PRODUCT PREVIEW
Hi-Speed USB2
Hi-Speed USB
32 Pin QFN
32 Pin QFN
ACTIVE
ULPI PHY
ULPI PHY
LEVEL
USB3300
USB3300
High
GND FLAG
N/A
N/A
N/A
Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface
6
DESCRIPTION
Ground
Ground
External 5 volt supply enable. This pin is used to
enable the external Vbus power supply. The CPEN
pin is low on POR.
VBUS pin of the USB cable. The USB3300 uses this
pin for the Vbus comparator inputs and for Vbus
pulsing during session request protocol.
24
23
22
21
20
19
18
17
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
SMSC USB3300