HI-8382CM-01 Holt Integrated Circuits, HI-8382CM-01 Datasheet - Page 5

• Manufacturer Part Number: HI-8382CM-01
• Manufacturer: Holt Integrated Circuits

Specifications of HI-8382CM-01

• Operating Temperature Classification: Military
• Operating Temperature (max): 125C
• Rad Hardened: No
• Lead Free Status / RoHS Status: Not Compliant

ORDERING INFORMATION
HI-8382 PACKAGE THERMAL CHARACTERISTICS
Notes:
HI -
1 6 L e a d C e r a m i c S B D I P
1 6 L e a d C e r a m i c S B D I P
1. All data taken
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
5. Similar results would be obtained with AOUT shorted to BOUT.
6. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
7. Data will vary depending on air flow and the method of heat sinking employed.
PA C K A G E S T Y L E
PA C K A G E S T Y L E
as this is considered unrealistic for high speed operation.
838x x x - xx
2 8 L e a d P L C C
2 8 L e a d P L C C
in still air
(1) Process Flows M and DSCC always have Tin/Lead (Sn/Pb) solder lead finish.
(2) DSCC SMD# 5962-8687901EA. Only available in “C” package with Sn/Pb solder lead finish.
(3) Gold terminal finish is Pb-Free, RoHS compliant.
PART
NUMBER
NUMBER
(Ceramic)
NUMBER
1
1
Blank
PART
M-01
M-03
8382
8383
PART
on devices soldered to a single layer copper PCB (3" X 4.5" X .062").
T
C
S
U
H i g h S p e e d
H i g h S p e e d
L o w S p e e d
L o w S p e e d
H i g h S p e e d
H i g h S p e e d
A R I N C 4 2 9
A R I N C 4 2 9
L o w S p e e d
L o w S p e e d
DATA RATE
DATA RATE
A
PACKAGE
DESCRIPTION
16 PIN CERAMIC SIDE BRAZED DIP (16C)
28 PIN CERAMIC LEADLESS CHIP CARRIER (28S)
32 PIN CERQUAD (32U) not available with ‘M’ flow
RESISTANCE
OUT
37.5 Ohms
TEMPERATURE
13 Ohms
-55°C to +125°C
-40°C to +85°C
-55°C to +125°C
-55°C to +125°C
OUTPUT SERIES
and B
RANGE
HOLT INTEGRATED CIRCUITS
MAXIMUM ARINC LOAD
3
3
4
4
HI-8382, HI-8383
OUT
Ta = 25°C
Ta = 25°C
S U P P LY C U R R E N T ( m A )
S U P P LY C U R R E N T ( m A )
1 7 . 6
2 5 . 4
1 7 . 9
2 5 . 8
6 0 . 1
6 3 . 1
6 2 . 1
6 4 . 0
FUSE
Shorted To Ground
Yes
No
FLOW
DSCC
5
M
T
I
Ta = 85°C
Ta = 85°C
1 7 . 2
2 4 . 5
1 7 . 4
2 4 . 8
5 5 . 7
5 6 . 3
5 6 . 2
5 6 . 2
BURN
Yes
Yes
No
IN
No
Ta = 125°C
Ta = 125°C
1 7 . 0
2 4 . 2
1 7 . 1
2 4 . 4
5 2 . 4
5 2 . 3
5 3 . 0
5 2 . 2
7
2
2
(1) & (2)
5, 6, 7
NOTES
(1)
Ta = 25°C
Ta = 25°C
J U N C T I O N T E M P, T j ( ° C )
J U N C T I O N T E M P, T j ( ° C )
11 0
1 0 0
4 8
5 6
4 1
4 7
9 0
8 6
Tin/Lead Solder
FINISH
LEAD
Gold
Gold
Ta = 85°C
Ta = 85°C
1 4 4
11 2
1 0 7
11 0
1 0 3
1 5 7
1 5 0
1 4 5
(3) & (1)
(3) & (1)
NOTES
Ta = 125°C
Ta = 125°C
1 4 2
1 5 0
1 4 5
1 4 7
1 9 4
1 8 2
1 8 0
1 7 6