TZA3034TTDH NXP Semiconductors, TZA3034TTDH Datasheet - Page 10

TZA3034TTDH

Manufacturer Part Number
TZA3034TTDH
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TZA3034TTDH

Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Lead Free Status / RoHS Status
Not Compliant
Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. The numbers in brackets refer to the pad numbers of the naked die version.
THERMAL CHARACTERISTICS
1998 Jul 07
V
V
I
P
T
T
T
R
R
n
SYMBOL
SYMBOL
stg
j
amb
CC
n
tot
th(j-s)
th(j-a)
SDH/SONET STM1/OC3 postamplifiers
supply voltage
DC voltage
DC current
total power dissipation
storage temperature
junction temperature
ambient temperature
thermal resistance from junction to solder point
thermal resistance from junction to ambient
pins 4 and 5 (7 and 8): DIN and DINQ
pin 7 (13): CF
pin 8 (16): JAM
pins 9, 10, 12 and 13 (17, 18, 23 and 24):
STQ, ST, DOUTQ and DOUT
pin 15 (29): V
pin 16 (30): RSET
pin 4 and 5 (7 and 8): DIN and DINQ
pin 7 (13): CF
pin 8 (16): JAM
pins 9, 10, 12 and 13 (17, 18, 23 and 24):
STQ, ST, DOUTQ and DOUT
pin 15 (29): V
pin 16 (30): RSET
PARAMETER
ref
ref
PARAMETER
10
note 1
note 1
CONDITIONS
TZA3034T; TZA3034U
V
0.5
0.5
0.5
0.5
0.5
0.5
1
1
1
25
2
2
65
40
CC
MIN.
VALUE
2
tbf
tbf
+6
V
V
V
V
+3.2
V
+1
+1
+1
+10
+2.5
+2
tbf
+150
150
+85
Objective specification
CC
CC
CC
CC
CC
MAX.
+ 0.5 V
+ 0.5 V
+ 0.5 V
+ 0.5 V
+ 0.5 V
UNIT
V
V
mA
mA
mA
mA
mA
mA
mW
K/W
K/W
C
C
C
UNIT

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