tza3034 NXP Semiconductors, tza3034 Datasheet

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tza3034

Manufacturer Part Number
tza3034
Description
Sdh/sonet Stm1/oc3 Postamplifier
Manufacturer
NXP Semiconductors
Datasheet

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Product specification
Supersedes data of 1999 Mar 16
File under Integrated Circuits, IC19
DATA SHEET
TZA3034
SDH/SONET STM1/OC3
postamplifier
INTEGRATED CIRCUITS
1999 Nov 03

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tza3034 Summary of contents

Page 1

... DATA SHEET TZA3034 SDH/SONET STM1/OC3 postamplifier Product specification Supersedes data of 1999 Mar 16 File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 1999 Nov 03 ...

Page 2

... Wideband RF gain block. GENERAL DESCRIPTION The TZA3034 is a high gain limiting amplifier that is designed to process signals from fibre optic preamplifiers like the TZA3033 pin compatible with the NE/SA5224 and NE/SA5225 but with extended power supply range, and needs less external components ...

Page 3

... DOUT A3 (23) 12 DOUTQ (16) 8 JAM (18 (17) 9 STQ (27, 28 CCD MGR281 SUB 1 16 RSET TEST ref CCD AGND DIN 4 13 DOUT TZA3034TT 5 12 DINQ DOUTQ V CCA 6 11 DGND JAM 9 STQ MBK997 Fig.3 Pin configuration of TZA3034TT. ...

Page 4

... V; threshold level is set by connecting an external resistor CCA between V and pin RSET or by forcing a current into pin RSET; CCA default value for this resistor is 180 k which corresponds with approximately 4 mV (p-p) differential input signal not connected 4 Product specification TZA3034 DESCRIPTION CCA CCD ...

Page 5

... Therefore a DC offset compensation circuit is implemented in the TZA3034, which keeps the input of buffer A3 at its toggle point in the absence of any input signal. An input signal level detection is implemented to check if the input signal is above the user-programmed level ...

Page 6

... For the TZA3034T (SO package), the worst case die temperature T the maximum operating temperature. For the TZA3034TT (TSSOP package), the worst case die temperature T and than the maximum operating temperature, and therefore CCA strongly discouraged recommended to lower the thermal resistance from junction to ambient, e ...

Page 7

... Output signal on pins DOUTQ or STQ; complementary to output signal (1) Fig.4 Logic level symbol definitions for PECL outputs. handbook, halfpage 1999 Nov 03 (1) (2) MGS812 V CC DIN 4 MGR958 Fig.5 Data input circuit DIN and DINQ. 7 Product specification TZA3034 OH(max) V OH(min) V OL(max) V OL(min) GND DINQ 4.5 k ...

Page 8

... R ADJ RSET V RSET TZA3034 I RSET MGS813 Fig.6 level detect input circuit RSET LOW V HIGH Fig.7 PECL output circuit ST and STQ 105 105 9 mA 0.5 mA Fig.8 PECL output circuit DOUT and DOUTQ. 8 Product specification TZA3034 MGS814 DOUT DOUTQ 0.5 mA MGR247 ...

Page 9

... Nov 3 127 82.5 GND 5 83 125 GND Fig.9 PECL output termination schemes. 9 Product specification TZA3034 MGR248 R1 = 127 R2 = 82.5 MGR249 125 MGR250 ...

Page 10

... Note 1. Thermal resistance from junction to ambient is determined with the IC soldered on a standard single-sided 57 57 1.6 mm FR4 epoxy printed-circuit board with 35 m thick copper traces. The measurements are performed in still air. 1999 Nov 03 PARAMETER CONDITION 10 Product specification TZA3034 MIN. MAX. UNIT 0 0 0.5 V ...

Page 11

... CCA CCA V = 155 Mbit/s PRBS sequence; note 5 electrically measured note 5 0.5 note note 20% to 80%; note 5 80% to 20%; note 5 note 5 11 Product specification TZA3034 MIN. TYP. MAX. 3.3 5 110 300 +125 +25 +85 1.5 3.0 2.1 V CCA 50 3 4.5 7.6 2.5 40 ...

Page 12

... note 9 20 note 10 1.165 = 125 5.5 V and worst case processing CCA 2 V (see Fig.9 Product specification TZA3034 TYP. MAX. 1.84 V 1.6 CC 1 100 1000 V 1.49 CC 1.165 +20 1.20 1.235 10 . and pin RSET. The corresponding input UNIT ...

Page 13

... DOUT Fig.11 Differential output voltage as function of MGR946 2.0 handbook, halfpage t (ns) 1.8 1.6 1.4 1.2 1 Fig.13 Differential output rise time and fall time as 13 Product specification TZA3034 MGR945 DOUTQ junction temperature. MGR947 i(dif)(p-p) (V) function of differential input voltage. ...

Page 14

... ( pattern PRBS pattern. Fig.17 Status detect hysteresis as function of 14 Product specification TZA3034 MGR949 (1) (2) (3) ( RSET ( DINQ 7 1 PRBS pattern (pin ST = HIGH PRBS pattern (pin ST = LOW). ...

Page 15

... Fig.19 Status detect ratio as function of I MGR954 1.55 handbook, halfpage V RSET (V) 1.53 1.51 1. RSET ( ( function of PWD Fig. Product specification TZA3034 (1) ( RSET ( A) I RSET where V = input low threshold (pin ST = LOW). = ------------- - i(dif dif 1 PRBS pattern. (1) ( ...

Page 16

... Philips Semiconductors SDH/SONET STM1/OC3 postamplifier handbook, full pagewidth 200 mV/div Fig.22 Differential output waveform with 4 mV differential input voltage. handbook, full pagewidth 200 mV/div Fig.23 Differential output waveform with 2 V differential input voltage. 1999 Nov 03 MGR942 MGR943 16 Product specification TZA3034 ...

Page 17

... TZA3034 (1, 14) (16) (17) (18) (19, 20, 22, 25 AGND SUB JAM STQ ST Fig.24 Application diagram. 17 Product specification TZA3034 100 nF V CCD DOUT (24) 13 data out DOUTQ (23) 12 DGND level detect status MGR284 ...

Page 18

... GND GND GND 29.2 pF optional noise filter: 3-pole, 120 MHz Bessel (1) Ferrite bead e.g. Murata BLM10A700S. The numbers in brackets refer to the pad numbers of the bare die version. Fig.25 STM1/OC3 receiver using the TZA3033T and TZA3034 680 nF (1) 100 nF 135 k RSET CF V CCA ...

Page 19

... Fig.26). 1999 Nov 03 ( +647.8 +647.8 +647.8 +507.1 +350.0 +210.0 +70.0 70.0 210.0 350.0 507.1 647.8 647.8 647.8 78.6 647.8 647.8 647.8 647.8 647.8 507.1 350.0 210.0 70.0 +70.0 +210.0 +350.0 +507.1 +647.8 +647.8 +647.8 +647.8 78.6 +647.8 19 Product specification TZA3034 ...

Page 20

... DIN TZA3034U (1) 1.55 mm Fig.26 Bonding pad locations of TZA3034U. 2 1. Product specification TZA3034 CCD 27 26 TEST 25 DGND 24 DOUT 23 DOUTQ 22 DGND 21 TEST 20 DGND 18 19 MGR283 VALUE 90 m (pad size = 100 ...

Page 21

... 2.5 scale (1) ( 0.49 0.25 10.0 4.0 6.2 1.27 0.36 0.19 9.8 3.8 5.8 0.0100 0.39 0.16 0.244 0.050 0.0075 0.38 0.15 0.228 REFERENCES JEDEC EIAJ MS-012AC 21 Product specification TZA3034 detail 1.0 0.7 1.05 0.25 0.25 0.1 0.4 0.6 0.039 0.028 0.041 0.01 0.01 0.004 0.016 0.020 ...

Page 22

... Nov 2.5 scale (1) ( 0.2 5.1 4.5 6.6 0.65 0.1 4.9 4.3 6.2 REFERENCES JEDEC EIAJ MO-153 22 Product specification TZA3034 detail 0.75 0.4 1.0 0.2 0.13 0.1 0.50 0.3 EUROPEAN ISSUE DATE PROJECTION SOT403-1 ( ...

Page 23

... Use a low voltage ( less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds 300 C. When using a dedicated tool, all other leads can be soldered in one operation within seconds between 270 and 320 C. 23 Product specification TZA3034 ...

Page 24

... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Nov 03 SOLDERING METHOD WAVE not suitable (2) suitable (3)(4) not recommended (5) not recommended 24 Product specification TZA3034 (1) REFLOW suitable suitable suitable suitable suitable ...

Page 25

... Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of the die the responsibility of the customer to test and qualify their application in which the die is used. 1999 Nov 03 25 Product specification TZA3034 ...

Page 26

... Philips Semiconductors SDH/SONET STM1/OC3 postamplifier 1999 Nov 03 NOTES 26 Product specification TZA3034 ...

Page 27

... Philips Semiconductors SDH/SONET STM1/OC3 postamplifier 1999 Nov 03 NOTES 27 Product specification TZA3034 ...

Page 28

Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + 101 ...

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