TZA3034TTDH-T NXP Semiconductors, TZA3034TTDH-T Datasheet - Page 4

TZA3034TTDH-T

Manufacturer Part Number
TZA3034TTDH-T
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TZA3034TTDH-T

Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Lead Free Status / RoHS Status
Not Compliant
Philips Semiconductors
1998 Jul 07
handbook, halfpage
SDH/SONET STM1/OC3 postamplifiers
AGND
V CCA
TEST
DINQ
SUB
JAM
DIN
CF
Fig.2 Pin configuration.
1
2
3
4
5
6
7
8
TZA3034T
MGR282
16
15
14
13
12
11
10
9
RSET
V ref
V CCD
DOUT
DOUTQ
DGND
ST
STQ
4
PAD CONFIGURATION
Pad centre locations
Note
1. Coordinates represent the position of the centre of the
SUB
TEST
AGND
AGND
n.c.
AGND
DIN
DINQ
AGND
TEST
V
V
CF
SUB
TEST
JAM
STQ
ST
DGND
DGND
TEST
DGND
DOUTQ
DOUT
DGND
TEST
V
V
V
RSET
n.c.
n.c.
CCA
CCA
CCD
CCD
ref
pad, in m, with respect to the centre of the die.
SYMBOL
PAD
TZA3034T; TZA3034U
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1
2
3
4
5
6
7
8
9
+218.5
+375.6
+532.7
+647.8
+647.8
+647.8
+647.8
+61.4
647.8
647.8
647.8
647.8
532.7
392.7
235.6
COORDINATES
235.7
392.8
532.8
647.8
647.8
647.8
647.8
647.8
647.8
647.8
647.8
532.8
392.8
235.7
78.5
78.6
78.6
Objective specification
x
+647.8
+647.8
+647.8
+507.1
+350.0
+210.0
+647.8
+70.0
210.0
350.0
507.1
647.8
647.8
647.8
647.8
210.0
350.0
507.1
647.8
647.8
647.8
647.8
647.8
647.8
647.8
647.8
507.1
350.0
210.0
70.0
70.0
70.0
(1)
y

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