TZA3046UN1 NXP Semiconductors, TZA3046UN1 Datasheet - Page 4

• Manufacturer Part Number: TZA3046UN1
• Manufacturer: NXP Semiconductors

Specifications of TZA3046UN1

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Philips Semiconductors
Table 2:
Bonding pad locations with respect to the center of the die (see
[1]
7. Functional description
TZA3046_1
Product data sheet
Symbol
GND
GND
OUTQ
OUT
AGC
IDREF_MON
V
CC
These pads go HIGH when current flows into pad IPHOTO.
Bonding pad description
Pad X
11
12
13
14
15
16
17
7.1 PIN diode connections
486.4
346.4
206.4
66.4
73.6
213.6
353.6
The TZA3046 is a TransImpedance Amplifier (TIA) intended for use in fiber optic receivers
for signal recovery in FC/GE or FTTx applications. It amplifies the current generated by a
photo detector (PIN diode or avalanche photodiode) and converts it to a differential output
voltage.
The most important characteristics of the TZA3046 are high receiver sensitivity, wide
dynamic range and large bandwidth. Excellent receiver sensitivity is achieved by
minimizing transimpedance amplifier noise.
The TZA3046 has a wide dynamic range to handle the signal current generated by the
PIN diode which can vary from 2.5 A to 1.7 mA (p-p). This is implemented by an AGC
loop which reduces the preamplifier feedback resistance so that the amplifier remains
linear over the whole input range. The AGC loop hold capacitor is integrated on-chip, so
an external capacitor is not required.
The bandwidth of TZA3046 is optimized for FC/GE application. It works from DC onward
due to the absence of offset control loops. Therefore the amount of Consecutive Identical
Digits (CID) will not effect the output waveform. A differential amplifier converts the output
of the preamplifier to a differential voltage.
The performance of an optical receiver is largely determined by the combined effect of the
transimpedance amplifier and the PIN diode. In particular, the method used to connect the
PIN diode to the input (pad IPHOTO) and the layout around the input pad strongly
influences the main parameters of a transimpedance amplifier, such as sensitivity,
bandwidth, and PSRR.
Sensitivity is most affected by the value of the total capacitance at the input pad.
Therefore, to obtain the highest possible sensitivity the total capacitance should be as low
as possible.
Y
278.6
278.6
278.6
278.6
278.6
278.6
278.6
…continued
Type
ground
ground
output
output
input
output
supply
Rev. 01 — 19 May 2006
Description
ground; connect together pads 9, 10, 11 and pad 12 as many as
possible
ground; connect together pads 9, 10, 11 and pad 12 as many as
possible
data output; complement of pad OUT; use pad 7 or pad 13
data output; use pad 8 or pad 14
AGC voltage; use pad 6 or pad 15
current output for RSSI measurements; connect a resistor to pad 5
or pad 16 and ground
supply voltage; connect supply voltage to pad 4 or pad 17
Fiber Channel/Gigabit Ethernet transimpedance amplifier
Figure
10); X and Y are in m.
[1]
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
TZA3046
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