MT48LC16M16A2P-75:D Micron Technology Inc, MT48LC16M16A2P-75:D Datasheet - Page 83
![IC, SDRAM, 256MBIT, 133MHZ, TSOP-54](/photos/19/4/190474/4467789_sml.jpg)
MT48LC16M16A2P-75:D
Manufacturer Part Number
MT48LC16M16A2P-75:D
Description
IC, SDRAM, 256MBIT, 133MHZ, TSOP-54
Manufacturer
Micron Technology Inc
Type
SDRAMr
Series
-r
Specifications of MT48LC16M16A2P-75:D
Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Memory Type
DRAM - Sychronous
Memory Configuration
16 X 16
Access Time
5.4ns
Page Size
256Mbit
Memory Case Style
TSOP
No. Of Pins
54
Operating Temperature Range
0°C To +70°C
Format - Memory
RAM
Memory Size
256M (16Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP (0.400", 10.16mm Width)
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT48LC16M16A2P-75:D
Manufacturer:
SAMTEC
Quantity:
1 200
Company:
Part Number:
MT48LC16M16A2P-75:D
Manufacturer:
MICRON
Quantity:
5 520
Company:
Part Number:
MT48LC16M16A2P-75:D
Manufacturer:
MICRON
Quantity:
6 000
Company:
Part Number:
MT48LC16M16A2P-75:D
Manufacturer:
MICRON42
Quantity:
175
Part Number:
MT48LC16M16A2P-75:D
Manufacturer:
MICRON
Quantity:
20 000
SELF REFRESH Operation
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
The self refresh mode can be used to retain data in the device, even when the rest of the
system is powered down. When in self refresh mode, the device retains data without
external clocking. The SELF REFRESH command is initiated like an AUTO REFRESH
command, except CKE is disabled (LOW). After the SELF REFRESH command is regis-
tered, all the inputs to the device become “Don’t Care” with the exception of CKE,
which must remain LOW.
After self refresh mode is engaged, the device provides its own internal clocking, ena-
bling it to perform its own AUTO REFRESH cycles. The device must remain in self
refresh mode for a minimum period equal to
an indefinite period beyond that.
The procedure for exiting self refresh requires a sequence of commands. First, CLK
must be stable prior to CKE going back HIGH. (Stable clock is defined as a signal cycling
within timing constraints specified for the clock ball.) After CKE is HIGH, the device
must have NOP commands issued for a minimum of two clocks for
required for the completion of any internal refresh in progress.
Upon exiting the self refresh mode, AUTO REFRESH commands must be issued accord-
ing to the distributed refresh rate (
AUTO REFRESH utilize the row refresh counter.
83
t
REF/refresh row count) as both SELF REFRESH and
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
RAS and remains in self refresh mode for
256Mb: x4, x8, x16 SDRAM
SELF REFRESH Operation
© 1999 Micron Technology, Inc. All rights reserved.
t
XSR because time is