MT49H16M18CBM-25 Micron Technology Inc, MT49H16M18CBM-25 Datasheet - Page 26

• Manufacturer Part Number: MT49H16M18CBM-25
• Manufacturer: Micron Technology Inc
• Type: RLDRAMr

Specifications of MT49H16M18CBM-25

• Organization: 16Mx18
• Density: 288Mb
• Address Bus: 23b
• Maximum Clock Rate: 400MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: uBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 779mA
• Pin Count: 144
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

Table 15:
Figure 8:
PDF: 09005aef815b2df8/Source: 09005aef811ba111
288Mb_RLDRAM_II_SIO_Core2.fm - Rev. O 1/11 EN
Rev. A die
Rev. B die
Package
Thermal Impedance
Example Temperature Test Point Location
Substrate
2-layer
4-layer
2-layer
4-layer
Notes:
1. Thermal impedance data is based on a number of samples from multiple lots and should be
Test point
viewed as a typical number.
Airflow = 0m/s
θ JA (°C/W)
41.2
28.2
TBD
TBD
11.00
288Mb: x18 2.5V V
Airflow = 1m/s
5.50
θ JA (°C/W)
29.1
21.9
TBD
TBD
29
9.25
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Temperature and Thermal Impedance
18.50
EXT
Airflow = 2m/s
θ JA (°C/W)
, 1.8V V
19.9
25.3
TBD
TBD
DD
, HSTL, SIO, RLDRAM II
©2003Micron Technology, Inc. All rights reserved.
θ JB (°C/W)
14.3
13.6
TBD
TBD
θ JC (°C/W)
2.27
TBD