S29GL064N90BFI040 Spansion Inc., S29GL064N90BFI040 Datasheet - Page 16

• Manufacturer Part Number: S29GL064N90BFI040
• Manufacturer: Spansion Inc.

Specifications of S29GL064N90BFI040

• Cell Type: NOR
• Density: 64Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 23/22Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: FBGA
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 8M/4M
• Supply Current: 50mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / RoHS Status: Compliant

7.
7.1
16
S29GL064N
Ordering Information–S29GL064N
Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29GL064N, 64 Megabit Page-Mode Flash Memory
Manufactured using 110 nm MirrorBit
90
T
S29GL064N Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading S29 and packing type designator from ordering part number.
4. Contact local sales for availability for Leaded lead-frame parts.
Device Number
F
S29GL064N
I
02
2
PACKING TYPE
0
2
3
MODEL NUMBER
01 = x8/x16, V
02 = x8/x16, V
03 = x8/x16, V
04 = x8/x16, V
06 = x16, V
07 = x16, V
V1 = x8/x16, V
V2 = x8/x16, V
V6 = x16, V
V7 = x16, V
TEMPERATURE RANGE
I
PACKAGE MATERIAL SET
A
F
PACKAGE TYPE
B
D = Fortified Ball-Grid Array Package(LAE064), 9 mm x 9 mm
F
T
SPEED OPTION
See Product Selector Guide and Valid Combinations (90 = 90 ns, 11 = 110 ns)
= Tray
= 7-inch Tape and Reel
= 13-inch Tape and Reel
= Industrial (–40°C to +85°C)
= Standard
= Pb-Free
= Fine-pitch Ball-Grid Array Package
= Fortified Ball-Grid Array Package (LAA064), 13 mm x 11 mm
= Thin Small Outline Package (TSOP) Standard Pinout
Option
Speed
90
11
90
11
90
90
11
90
11
®
Process Technology, 3.0 Volt-only Read, Program, and Erase
S29GL064N Valid Combinations
CC
CC
CC
CC
Package, Material, &
Temperature Range
CC
CC
CC
CC
= 2.7 – 3.6 V, Uniform sector, WP# = V
= 2.7 – 3.6 V, Uniform sector, WP# = V
CC
CC
= 2.7 – 3.6 V, V
= 2.7 – 3.6 V, V
(Note 4)
S29GL-N MirrorBit
= V
= V
= 2.7 – 3.6 V, Top boot sector, WP#/ACC = V
= 2.7 – 3.6 V, Bottom boot sector, WP#/ACC = V
= 2.7 – 3.6 V, V
= 2.7 – 3.6 V, V
IO
IO
BFI
DFI
TFI
FFI
= 2.7 – 3.6 V, Uniform sector, WP#/ACC = V
= 2.7 – 3.6 V, Uniform sector, WP#/ACC = V
IO
IO
= 1.65 - 3.6 V, Uniform sector, WP# = V
= 1.65 - 3.6 V, Uniform sector, WP# = V
IO
IO
D a t a
= 1.65 - 3.6 V, Uniform sector, WP#/ACC = V
= 1.65 - 3.6 V, Uniform sector, WP#/ACC = V
®
Model Number
03, 04, 06, 07
01, 02, 03, 04
01, 02, 03, 04
Flash Family
V6, V7
V1, V2
V1, V2
V1, V2
01, 02
03, 04
S h e e t
IL
IL
protects lowest addressed sector
protects highest addressed sector
Packing Type
0,2,3
IL
protects top two addressed sectors
IL
(Note 1)
IL
IL
protects bottom two addressed sectors
protects highest addressed sector
protects lowest addressed sector
IL
IL
protects lowest addressed sector
protects highest addressed sector
S29GL-N_01_12 October 29, 2008
VBK048
LAA064
LAE064
TS048
TS056
IL
IL
protects highest addressed sector
protects lowest addressed sector
Package Description
(Note 2)
(Note 2)
(Note 3)
(Note 3)
(Note 3)
Fine-Pitch BGA
Fortified BGA
TSOP