S29GL064N90BFI040 Spansion Inc., S29GL064N90BFI040 Datasheet - Page 72

• Manufacturer Part Number: S29GL064N90BFI040
• Manufacturer: Spansion Inc.

Specifications of S29GL064N90BFI040

• Cell Type: NOR
• Density: 64Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 23/22Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: FBGA
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 8M/4M
• Supply Current: 50mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / RoHS Status: Compliant

72
Notes
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. D
4. Illustration shows device in word mode.
Addresses
Figure 15.11 Alternate CE# Controlled Write (Erase/Program) Operation Timings
RESET#
RY/BY#
WE#
Data
OE#
CE#
t
RH
PBA for program
2AA for erase
t
t
t
WS
WH
WC
S29GL-N MirrorBit
PBD for program
55 for erase
t
GHEL
t
t
t
DS
CP
SA for program buffer to flash
SA for sector erase
555 for chip erase
CPH
t
AS
t
DH
D a t a
t
AH
®
Flash Family
OUT
29 for program buffer to flash
30 for sector erase
10 for chip erase
is the data written to the device.
t
BUSY
S h e e t
t
WHWH1 or 2
Data# Polling
S29GL-N_01_12 October 29, 2008
DQ7#
PA
D
OUT