S29GL064N90BFI040 Spansion Inc., S29GL064N90BFI040 Datasheet - Page 75

• Manufacturer Part Number: S29GL064N90BFI040
• Manufacturer: Spansion Inc.

Specifications of S29GL064N90BFI040

• Cell Type: NOR
• Density: 64Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 23/22Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: FBGA
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 8M/4M
• Supply Current: 50mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / RoHS Status: Compliant

17.2
October 29, 2008 S29GL-N_01_12
STANDARD PIN OUT (TOP VIEW)
A
Package
Symbol
Jedec
N
2
D1
A1
A2
b1
c1
1
A
b
D
E
L
0
R
N
c
e
SEATING PLANE
2X (N/2 TIPS)
19.80
18.30
13.90
0.95
0.10
PARALLEL TO
MIN
0.05
0.50
0.08
0.17
0.17
0.10
0˚
TS056—56-Pin Standard Thin Small Outline Package (TSOP)
MO-142 (D) EC
0.25
0.50 BASIC
2
TS 056
18.40
14.00
NOM
20.00
1.00
0.20
0.22
0.60
56
SEE DETAIL B
20.20
18.50
14.10
MAX
1.20
0.15
1.05
0.23
0.70
0.27
0.16
0.21
0.20
B
8˚
B
D1
D
NOTES:
1
2
3
4
5
6
7
8
9
DETAIL A
5
4
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE UP).
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF
CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT
HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS
0.15mm (.0059") PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE
0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE
BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND
0.25MM (0.0098") FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10mm (0.004") AS MEASURED FROM THE SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
θ°
SEE DETAIL A
L
2X
D a t a
N
N
2
0.10
+1
S29GL-N MirrorBit
R
B
2X
C
S h e e t
(c)
E
0.10
5
0.25MM (0.0098") BSC
A
A2
GAUGE PLANE
®
Flash Family
7
SEATING
PLANE
A1
C
(c)
2X (N/2 TIPS)
e
0.10
9
SECTION B-B
0.08MM
N
2
1
b1
b
(0.0031")
REVERSE PIN OUT (TOP VIEW)
3
M
DETAIL B
C A - B S
6
c1
BASE METAL
WITH PLATING
7
X = A OR B
e/2
X
3356 \ 16-038.10c
N
N
2
+1
75