5962-8953702YA QP SEMICONDUCTOR, 5962-8953702YA Datasheet - Page 4

• Manufacturer Part Number: 5962-8953702YA
• Manufacturer: QP SEMICONDUCTOR

Specifications of 5962-8953702YA

• Lead Free Status / RoHS Status: Not Compliant

DSCC FORM 2234
APR 97
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where the entire SMD PIN number is not
feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
manufacturer prior to delivery.
specified in 4.4.
procedures and characteristics specified in 4.5.
pattern or erased. As a minimum, verification shall consist of performing a functional test (subgroup 7) to verify that all bits are
in the proper state. Any bit that does not verify to be in the proper state shall constitute a device failure and shall be removed
from the lot.
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
with each lot of microcircuits delivered to this drawing.
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
reprogrammability test shall be done for initial characterization and after any design or process changes which may affect the
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase endurance cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure
shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with
test data.
be done for initial characterization and after any design or process change which may affect data retention. The methods and
procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military
temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of
the acquiring or preparing activity, along with test data.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
3.6 Processing EPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the
3.6.1 Erasure of EPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics
3.6.2 Programmability of EPROMS. When specified, devices shall be programmed to the specified pattern using the
3.6.3 Verification of state of EPROMS. When specified, devices shall be verified as either programmed to the specified
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
3.9 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.10 Verification and review. DSCC, DSCC's agent and the acquiring activity retain the option to review the manufacturer's
3.11 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This
3.12 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
MICROCIRCUIT DRAWING
STANDARD
SIZE
A
REVISION LEVEL
B
SHEET
5962-89537
4