MCIMX27MOP4A Freescale, MCIMX27MOP4A Datasheet - Page 130

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MCIMX27MOP4A

Manufacturer Part Number
MCIMX27MOP4A
Description
Manufacturer
Freescale
Datasheet

Specifications of MCIMX27MOP4A

Lead Free Status / RoHS Status
Compliant

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Package Information and Pinout
5.4
Table 61
Table 62
these pins depend solely upon the user application, however there are a few factory test signals that are
not used in a normal application. Following is a list of these signals and how they are to be terminated for
proper operation of the i.MX27/MX27L processor:
130
CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.
OSC26M_TEST: To ensure proper operation, leave this signal as no connect.
EXT_60M: To ensure proper operation, connect this signal to ground.
EXT_266M: To ensure proper operation, connect this signal to ground.
Most of the signals shown in
of the signals at a particular pad are shown in the form of a compound signal name. Refer to
for complete information on the signal multiplexing schemes of these signals.
identifies the pin assignments for the ball grid array (BGA) for full package. The connections of
shows the i.MX27 full 19 × 19 mm package MAPBGA pin assignment.
Pin Assignments (19 mm × 19 mm)
i.MX27 and i.MX27L Data Sheet, Rev. 1.6
Table 62
are multiplexed with other signals. For ease of reference, all
Freescale Semiconductor
Table 3

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