ISP1583ET2,518 NXP Semiconductors, ISP1583ET2,518 Datasheet - Page 89
ISP1583ET2,518
Manufacturer Part Number
ISP1583ET2,518
Description
Manufacturer
NXP Semiconductors
Datasheet
1.ISP1583ET2518.pdf
(100 pages)
Specifications of ISP1583ET2,518
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
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NXP Semiconductors
Fig 41. Package outline SOT969-1 (TFBGA64)
ISP1583_7
Product data sheet
TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 4 x 4 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT969-1
VERSION
OUTLINE
max
1.1
A
0.25
0.15
A
1
ball A1
index area
ball A1
index area
0.85
0.75
A
2
IEC
- - -
G
H
E
D
C
B
A
F
0.3
0.2
b
1
1/2 e
2
4.1
3.9
D
3
e
4
e
D
1
4.1
3.9
JEDEC
5
E
- - -
6
b
7
REFERENCES
0.4
0
e
Rev. 07 — 22 September 2008
8
2.8
e
1
B
e
w
JEITA
v
1/2 e
2.8
e
- - -
2
A
E
M
M
scale
2.5
C
C
e
0.15
2
A
v
B
0.05
w
A
A
0.08
2
5 mm
y
A
1
y
1
0.1
y
C
Hi-Speed USB peripheral controller
1
detail X
PROJECTION
EUROPEAN
X
C
y
© NXP B.V. 2008. All rights reserved.
ISP1583
ISSUE DATE
06-09-22
06-09-27
SOT969-1
88 of 99
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