STPCE1HEBC STMicroelectronics, STPCE1HEBC Datasheet - Page 80

• Manufacturer Part Number: STPCE1HEBC
• Manufacturer: STMicroelectronics

Specifications of STPCE1HEBC

• Operating Temperature (min): 0C
• Operating Temperature (max): 70C
• Processing Unit: Microprocessor
• Operating Supply Voltage (min): 2.45/3V
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.7/3.6V
• Package Type: BGA
• Screening Level: Commercial
• Pin Count: 388
• Mounting: Surface Mount
• Rad Hardened: No
• Lead Free Status / RoHS Status: Not Compliant

DESIGN GUIDELINES
As the PCB acts as a heat sink, the layout of top
and ground layers must be done with care to
maximize the board surface dissipating the heat.
The only limitation is the risk of losing routing
channels.
80/87
A
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1
Figure 6-29
Figure 6-29. Layout for Good Thermal Dissipation - top layer
and
Figure 6-30
STPC ball
Via
Not Connected ball
Release 1.3 - January 29, 2002
show a
routing with a good thermal dissipation thanks to
an optimized placement of power and signal vias.
The ground plane should be on bottom layer for
the best heat spreading (thicker layer than internal
ones) and dissipation (direct contact with air). .
GND ball
3.3V ball
2.5V ball (Core / PLLs)