LH7A400N0F000B3A,5 NXP Semiconductors, LH7A400N0F000B3A,5 Datasheet - Page 60

• Manufacturer Part Number: LH7A400N0F000B3A,5
• Manufacturer: NXP Semiconductors

Specifications of LH7A400N0F000B3A,5

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Processing Unit: Microprocessor
• Operating Supply Voltage (min): 1.71V
• Operating Supply Voltage (typ): 1.8V
• Operating Supply Voltage (max): 1.89V
• Package Type: LFBGA
• Pin Count: 256
• Mounting: Surface Mount
• Rad Hardened: No
• Lead Free Status / RoHS Status: Compliant

LH7A400
60
LFBGA256: plastic low profile fine-pitch ball grid array package; 256 balls
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT1020-1
OUTLINE
VERSION
max
1.7
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
M
T
P
K
H
F
D
B
R
N
G
C
L
J
E
A
1.35
1.15
A
2
1
IEC
2
0.5
0.4
b
3
Figure 49. Package outline SOT1020-1 (LFBGA256)
4
14.1
13.9
5
D
e
6
7
14.1
13.9
8
JEDEC
E
e
D
1
9
10
REFERENCES
1/2 e
0.8
11
e
0
Rev. 01 — 16 July 2007
12
NXP Semiconductors
13
e
12
14
1
b
15
16
JEITA
e
12
2
scale
5
1/2 e
0.15
B
e
v
∅ v
∅ w
e
A
E
M
M
2
0.08
w
C
C
A
10 mm
0.12
y
B
A
A
0.1
2
y
1
A
y
1
1
C
PROJECTION
EUROPEAN
detail X
32-Bit System-on-Chip
Preliminary data sheet
C
X
y
ISSUE DATE
07-07-07
07-07-07
SOT1020-1