XC56309VF100A Freescale, XC56309VF100A Datasheet - Page 75

XC56309VF100A

Manufacturer Part Number
XC56309VF100A
Description
Manufacturer
Freescale
Datasheet

Specifications of XC56309VF100A

Device Core Size
24b
Format
Fixed Point
Clock Freq (max)
100MHz
Mips
100
Device Input Clock Speed
100MHz
Ram Size
102KB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
196
Package Type
MA-BGA
Lead Free Status / RoHS Status
Not Compliant

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3.2 TQFP Package Mechanical Drawing
Freescale Semiconductor
Pin 1
ident
L
C
J
36
1
4X
0.08
Section J1-J1
144
37
(rotated 90)
0.20 T L-M
Figure 3-3.
144 PL
M
S1
D
F
A1
T L-M
N
N
A
S
Plating
Base
metal
AA
DSP56309 Mechanical Information, 144-pin TQFP Package
N
View Y
θ
θ
DSP56309 Technical Data, Rev. 7
2
2
4X 36 TIPS
C2
C1
109
72
0.05
View AB
108
73
CASE 918-03
T
0.20 T L-M
ISSUE C
M
(Y)
θ
View AB
0.1 T
B1 V1
Seating
plane
(Z)
144X
N
(K)
E
B
R2
V
R1
C L
Gage plane
0.25
θ
1
Notes:
TQFP Package Mechanical Drawing
1. Dimensions and tolerancing per ASME
2. Dimensions in millimeters.
3. Datums L, M and N to be determined at the
4. Dimensions S and V to be determined at
5. Dimensions A and B do not include mold
6. Dimension D does not include dambar
Y14.5, 1994.
seating plane, datum T.
the seating plane, datum T.
protrusion. Allowable protrusion is 0.25 per
side. Dimensions A and B do include mold
mismatch and are determined at datum
plane H.
protrusion. Allowable dambar protrusion
shall not cause the D dimension to exceed
0.35.
DIM
A1
B1
C1
C2
R1
R2
S1
V1
AA
θ
θ
C
D
G
A
B
E
F
K
P
S
V
Y
Z
θ
J
View Y
1
2
Millimeters
1.40
0.05
1.35
0.17
0.45
0.17
0.09
0.13
0.13
0.09
MIN
20.00 BSC
10.00 BSC
20.00 BSC
10.00 BSC
22.00 BSC
11.00 BSC
22.00 BSC
11.00 BSC
0.50 BSC
0.50 REF
0.25 BSC
0.25 REF
1.00 REF
11°
J1
J1
MAX
1.60
0.15
1.45
0.27
0.75
0.23
0.20
0.20
0.20
0.16
13°
140X
4X
G
X=L, M or N
X
P
3-9

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