MC9S08GB60ACFUE Freescale, MC9S08GB60ACFUE Datasheet - Page 103
MC9S08GB60ACFUE
Manufacturer Part Number
MC9S08GB60ACFUE
Description
Manufacturer
Freescale
Datasheet
1.MC9S08GB60ACFUE.pdf
(302 pages)
Specifications of MC9S08GB60ACFUE
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
4KB
# I/os (max)
56
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8/2.08V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
60KB
Lead Free Status / RoHS Status
Compliant
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Chapter 7
Internal Clock Generator (S08ICGV2)
The MC9S08GBxxA/GTxxA microcontroller provides one internal clock generation (ICG) module to
create the system bus frequency. All functions described in this section are available on the
MC9S08GBxxA/GTxxA microcontroller. The EXTAL and XTAL pins share port G bits 2 and 1,
respectively. Analog supply lines V
pins. Electrical parametric data for the ICG may be found in
Freescale Semiconductor
ICG
ICGLCLK*
ICGERCLK
FFE
Freescale Semiconductor recommends that flash location $FFBE be
reserved to store a nonvolatile version of ICGTRM. This will allow
debugger and programmer vendors to perform a manual trim operation and
store the resultant ICGTRM value for users to access at a later time.
ICGOUT
* ICGLCLK is the alternate BDC clock source for the MC9S08GBxxA/GTxxA.
CPU
÷
CONTROL
2
SYSTEM
LOGIC
÷
2
FIXED FREQ CLOCK (XCLK)
Figure 7-1. System Clock Distribution Diagram
RTI
BUSCLK
DDA
MC9S08GB60A Data Sheet, Rev. 2
and V
BDC
TPM1
SSA
NOTE
are internally derived from the MCU’s V
TPM2
Appendix A, “Electrical
ATD has min and max
frequency requirements. See
Chapter 1, “Device
Appendix A, “Electrical
IIC1
ATD1
SCI1
Overview” and
Characteristics.
RAM
SCI2
Characteristics.”
Flash has frequency
requirements for program
and erase operation.
See
Characteristics.
Appendix A, “Electrical
FLASH
DD
SPI1
and V
SS
103
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