MC9S08SH4CTG Freescale, MC9S08SH4CTG Datasheet - Page 17
MC9S08SH4CTG
Manufacturer Part Number
MC9S08SH4CTG
Description
Manufacturer
Freescale
Datasheet
1.MC9S08SH4CTG.pdf
(338 pages)
Specifications of MC9S08SH4CTG
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
256Byte
# I/os (max)
13
Number Of Timers - General Purpose
1
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Package Type
TSSOP
Program Memory Type
Flash
Program Memory Size
4KB
Lead Free Status / RoHS Status
Compliant
Available stocks
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Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08SH4CTG
Manufacturer:
FREESCAL
Quantity:
96
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Part Number:
MC9S08SH4CTG
Manufacturer:
Freescale
Quantity:
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Section Number
17.3 On-Chip Debug System (DBG) ....................................................................................................277
17.4 Register Definition ........................................................................................................................281
A.1 Introduction ...................................................................................................................................289
A.2 Parameter Classification ................................................................................................................289
A.3 Absolute Maximum Ratings ..........................................................................................................289
A.4 Thermal Characteristics .................................................................................................................291
A.5 ESD Protection and Latch-Up Immunity ......................................................................................293
A.6 DC Characteristics .........................................................................................................................294
A.7 Supply Current Characteristics ......................................................................................................298
A.8 External Oscillator (XOSC) Characteristics .................................................................................301
A.9 Internal Clock Source (ICS) Characteristics .................................................................................303
A.10 Analog Comparator (ACMP) Electricals ......................................................................................305
A.11 ADC Characteristics ......................................................................................................................306
A.12 AC Characteristics .........................................................................................................................309
A.13 FLASH Specifications ...................................................................................................................315
A.14 EMC Performance .........................................................................................................................316
B.1 Ordering Information ....................................................................................................................319
B.2 Mechanical Drawings ....................................................................................................................320
Freescale Semiconductor
17.2.2 Communication Details ..................................................................................................270
17.2.3 BDC Commands .............................................................................................................274
17.2.4 BDC Hardware Breakpoint .............................................................................................276
17.3.1 Comparators A and B ......................................................................................................277
17.3.2 Bus Capture Information and FIFO Operation ...............................................................277
17.3.3 Change-of-Flow Information ..........................................................................................278
17.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................278
17.3.5 Trigger Modes .................................................................................................................279
17.3.6 Hardware Breakpoints ....................................................................................................281
17.4.1 BDC Registers and Control Bits .....................................................................................281
17.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................283
17.4.3 DBG Registers and Control Bits .....................................................................................284
A.12.1 Control Timing ...............................................................................................................309
A.12.2 TPM/MTIM Module Timing ..........................................................................................311
A.12.3 SPI ...................................................................................................................................312
A.14.1 Radiated Emissions .........................................................................................................316
A.14.2 Conducted Transient Susceptibility ................................................................................316
B.1.1 Device Numbering Scheme ............................................................................................319
Ordering Information and Mechanical Drawings
MC9S08SH8 MCU Series Data Sheet, Rev. 3
Electrical Characteristics
Appendix A
Appendix B
Title
Page
17
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