MPC8349EVVAJFB Freescale, MPC8349EVVAJFB Datasheet - Page 74

MPC8349EVVAJFB

Manufacturer Part Number
MPC8349EVVAJFB
Description
Manufacturer
Freescale
Datasheet

Specifications of MPC8349EVVAJFB

Family Name
MPC83xx
Device Core
PowerQUICC II Pro
Device Core Size
32b
Frequency (max)
533MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.2V
Operating Supply Voltage (max)
1.26V
Operating Supply Voltage (min)
1.14V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
672
Package Type
TBGA
Lead Free Status / RoHS Status
Compliant

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Thermal
1
2
20 Thermal
This section describes the thermal specifications of the MPC8349EA.
20.1
Table 63
74
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (at 200 ft/min) on single-layer board (1s)
Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)
Junction-to-ambient (at 2 m/s) on single-layer board (1s)
Junction-to-ambient (at 2 m/s) on four-layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
No.
306
405
504
Ref
The PLL configuration reference number is the hexadecimal representation of RCWL, bits 4–15 associated with the SPMF and
COREPLL settings given in the table.
The input clock is CLKIN for PCI host mode or PCI_CLK for PCI agent mode.
1
SPMF
0011
0100
0101
provides the package thermal characteristics for the 672 35 × 35 mm TBGA of the MPC8349EA.
Thermal Characteristics
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
RCWL
0000110
0000101
0000100
CORE
PLL
Characteristic
(MHz)
Clock
Input
Freq
Table 62. Suggested PLL Configurations (continued)
Table 63. Package Thermal Characteristics for TBGA
400 MHz Device
2
(MHz)
CSB
Freq
(MHz)
Core
Freq
(MHz)
Clock
Input
Freq
533 MHz Device
2
(MHz)
CSB
Freq
Symbol
R
R
R
R
R
R
R
R
θJMA
θJMA
θJMA
θJMA
θJMA
θJC
θJA
θJB
(MHz)
Core
Freq
Value
(MHz)
3.8
1.7
Clock
14
11
11
Input
Freq
8
9
7
66
66
66
Freescale Semiconductor
667 MHz Device
2
(MHz)
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Freq
CSB
Unit
200
266
333
Notes
(MHz)
Core
Freq
600
667
667
1, 2
1, 3
1, 3
1, 3
1, 3
1, 3
4
5

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