UPD8670CY Renesas Electronics America, UPD8670CY Datasheet - Page 26

• Manufacturer Part Number: UPD8670CY
• Manufacturer: Renesas Electronics America

Specifications of UPD8670CY

• Lead Free Status / RoHS Status: Supplier Unconfirmed

RECOMMENDED SOLDERING CONDITIONS
consult with our sales offices.
Type of Through-hole Device
24
Cautions 1. During assembly care should be taken to prevent solder or flux from contacting the plastic cap.
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to
µ
Partial heating method
PD8670CY : CCD linear image sensor 32-pin plastic DIP (10.16 mm (400))
2. Soldering by the solder flow method may have deleterious effects on prevention of plastic cap
Process
The optical characteristics could be degraded by such contact.
soiling and heat resistance. So the method cannot be guaranteed.
Pin temperature : 350°C or below, Heat time : 3 seconds or less (per pin)
Data Sheet S16749EJ1V0DS
Conditions
µ
PD8670