BAP70AM.115 NXP Semiconductors, BAP70AM.115 Datasheet
BAP70AM.115
Specifications of BAP70AM.115
Related parts for BAP70AM.115
BAP70AM.115 Summary of contents
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BAP70AM Silicon PIN diode array Rev. 2 — 7 September 2010 1. Product profile 1.1 General description Four planar PIN diode array in SOT363 small SMD plastic package. 1.2 Features and benefits High voltage current controlled RF resistor for RF ...
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... NXP Semiconductors 4. Marking Table 3. Type number BAP70AM 5. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot T stg Thermal characteristics Table 5. Symbol R th(j-sp) BAP70AM Product data sheet Marking Marking code N9* Limiting values Parameter reverse voltage forward current ...
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... NXP Semiconductors 7. Characteristics Table 6. Characteristics ° unless otherwise specified. amb Symbol Parameter V forward voltage F I reverse current R C diode capacitance d r diode forward resistance D τ charge carrier life time L L series inductance S 600 C d (fF) 500 400 300 200 ° MHz Fig 1. ...
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... NXP Semiconductors 8. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.30 0.25 mm 0.1 0.8 0.20 0.10 OUTLINE VERSION IEC SOT363 Fig 3. Package outline SOT363 BAP70AM Product data sheet scale 2.2 1.35 2.2 1 ...
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... Release date BAP70AM v.2 20100907 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors • Legal texts have been adapted to the new company name where appropriate • Table 3 on page BAP70AM v.1 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 13. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 2 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 Legal information 11.1 Data sheet status ...