BAP70AM.115 NXP Semiconductors, BAP70AM.115 Datasheet - Page 2

BAP70AM.115

Manufacturer Part Number
BAP70AM.115
Description
Manufacturer
NXP Semiconductors
Type
Attenuatorr
Datasheet

Specifications of BAP70AM.115

Configuration
Double Dual Series
Forward Current
100mA
Forward Voltage
1.1V
Power Dissipation
300mW
Operating Temperature Classification
Military
Reverse Voltage
50V
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
100@0.5mAOhm
Maximum Series Resistance @ Maximum If
1.9@100mAOhm
Typical Carrier Life Time
1.25us
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
4. Marking
5. Limiting values
6. Thermal characteristics
BAP70AM
Product data sheet
Table 3.
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Table 5.
Type number
BAP70AM
Symbol
V
I
P
T
T
Symbol
R
F
stg
j
R
tot
th(j-sp)
Marking
Limiting values
Thermal characteristics
Parameter
thermal resistance from junction
to solder point
Parameter
reverse voltage
forward current
total power dissipation
storage temperature
junction temperature
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 September 2010
Marking code
N9*
Conditions
T
sp
= 90 °C
Conditions
Description
* = - : made in Hong Kong
* = p : made in Hong Kong
* = t : made in Malaysia
Min
-
-
-
−65
−65
Silicon PIN diode array
BAP70AM
Max
50
100
300
+150
+150
Typ
260
© NXP B.V. 2010. All rights reserved.
Unit
V
mA
mW
°C
°C
Unit
K/W
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