MT48H32M16LFCJ-8:A Micron Technology Inc, MT48H32M16LFCJ-8:A Datasheet - Page 51

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MT48H32M16LFCJ-8:A

Manufacturer Part Number
MT48H32M16LFCJ-8:A
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48H32M16LFCJ-8:A

Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
9/7ns
Maximum Clock Rate
125MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
85mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
Table 16:
Table 17:
Notes
PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. J 2/08 EN
Parameter
Parameter
Input capacitance: CLK
Input capacitance: All other input-only balls
Input/Output capacitance: DQs
Input capacitance: CLK
Input capacitance: All other input-only balls
Input/Output capacitance: DQs
Capacitance (x16)
Note: 2; notes appear on pages 51–52
Capacitance (x32)
Note: 2; notes appear on pages 51–52
10.
11. AC timing and I
1. All voltages referenced to V
2. This parameter is sampled. V
3.
4. Enables on-chip refresh and address counters.
5. The minimum specifications are used only to indicate cycle time at which proper
6. An initial pause of 100µs is required after power-up, followed by two AUTO REFRESH
7. AC characteristics assume
8. In addition to meeting the transition rate specification, the clock and CKE must tran-
9. Outputs measured for 1.8V at 0.9V with equivalent load:
0.9V, 1.25V, and 1.4V, respectively; f = 1 MHz.
I
with minimum cycle time and the outputs open.
operation over the full temperature range (–40°C ≤ T
ensured.
commands, before proper device operation is ensured. (V
ered up simultaneously. V
REFRESH command wake-ups should be repeated any time the
ment is exceeded.
sit between V
Test loads with full DQ driver strength. Performance will vary with actual system DQ
bus capacitive loading, termination, and programmed drive strength.
t
a reference to V
High-Z.
point. If the input transition time is longer than
enced at V
Q
DD
HZ defines the time at which the output achieves the open circuit condition; it is not
is dependent on output loading and cycle rates. Specified values are obtained
IL
(MAX) and V
IH
20pF
OH
and V
DD
or V
tests have V
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
IL
OL
(or between V
. The last valid data element will meet
IH
SS
t
51
SS
T = 1ns.
(MIN) and no longer at the V
and V
.
DD
IL
, V
and V
SS
DD
Symbol
Symbol
Q must be at same potential.) The two AUTO
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Q = +1.8V; T
C
C
C
C
C
C
IL
IO
IO
I1
I2
I1
I2
IH
and V
, with timing referenced to V
IH
) in a monotonic manner.
t
T (MAX), then the timing is refer-
A
Min
Min
= 25°C; ball under test biased at
2.0
2.0
2.5
2.0
2.0
2.5
A
≤ +85°C for T
IH
DD
/2 crossover point.
©2005 Micron Technology, Inc. All rights reserved.
and V
t
Max
Max
OH before going
5.0
5.0
6.0
5.0
5.0
6.0
t
REF refresh require-
A
DD
on IT parts) is
IH
Q must be pow-
/2 = crossover
Units
Units
pF
pF
pF
pF
pF
pF
Notes

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