PCF8591P NXP Semiconductors, PCF8591P Datasheet - Page 2

• Manufacturer Part Number: PCF8591P
• Description: IC, A/D AND D/A CONVERTER, 8BIT, 16-DIP
• Manufacturer: NXP Semiconductors
• Type: General Purposer

Specifications of PCF8591P

• Number Of Channels: 1
• Number Of Adc's: 1
• Number Of Dac's: 1
• Adc/dac Resolution: 8b
• Interface Type: Serial (I2C)
• Operating Supply Voltage (typ): 3.3/5V
• Sample Rate: 11.1KSPS
• Number Of Adc Inputs: 4
• Number Of Dac Outputs: 1
• Operating Supply Voltage (max): 6V
• Operating Supply Voltage (min): 2.5V
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Pin Count: 16
• Mounting: Through Hole
• Supply Voltage Range: 2.5V To 6V
• Operating Temperature Range: -40°C To +85°C
• Digital Ic Case Style: DIP
• No. Of Pins: 16
• Linearity Error -: 1.5LSB
• Termination Type: DIP
• Supply Voltage Max: 8V
• Input Channels Per Adc: 1
• Rohs Compliant: Yes
• Filter Terminals: DIP
• Conversion Time: 90µs
• Data Interface: I2C, Serial
• Lead Free Status / RoHS Status: Compliant

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
8
8.1
8.2
8.3
8.4
8.5
9
10
11
12
13
14
15
16
17
17.1
17.2
17.3
17.4
18
19
20
21
2003 Jan 27
8-bit A/D and D/A converter
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Addressing
Control byte
D/A conversion
A/D conversion
Reference voltage
Oscillator
CHARACTERISTICS OF THE I
Bit transfer
Start and stop conditions
System configuration
Acknowledge
I
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
D/A CHARACTERISTICS
A/D CHARACTERISTICS
AC CHARACTERISTICS
APPLICATION INFORMATION
PACKAGE OUTLINES
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C-bus protocol
2
C COMPONENTS
2
C-BUS
2
Product specification
PCF8591