ML610Q408-NNNTBZ03A7 Rohm Semiconductor, ML610Q408-NNNTBZ03A7 Datasheet - Page 24

• Manufacturer Part Number: ML610Q408-NNNTBZ03A7
• Description: MCU 8BIT 16K FLASH 8CH 100-TQFP
• Manufacturer: Rohm Semiconductor
• Series: -r

Specifications of ML610Q408-NNNTBZ03A7

• Core Processor: nX-U8/100
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SSP, UART/USART
• Peripherals: LCD, Melody Driver, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.25 V ~ 3.6 V
• Data Converters: A/D 2x16b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C
• Package / Case: 100-TFQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

ML610Q407/ML610Q408/ML610Q409 User's Manual
Chapter 1 Overview
1.3.1.4
Note:
The assignment of the pads P30 to P35 are not in order.
Pin Layout of ML610Q407 Chip
P20
P21
P22
P24
P00
P01
P02
P03
P04
P30
P31
P34
P32
P33
P35
P57
P56
P55
P54
P53
V
V
SS
PP
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
Figure 1-5 Dimensions of ML610Q407 Chip
Chip size: 2.27 mm × 2.23 mm
PAD count: 88 pins
Minimum PAD pitch: 80μm
PAD aperture: 70μm×70μm
Chip thickness: 350μm
Voltage of the rear side of chip: V
2.27mm
1-8
SS
level.
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
COM4/SEG2
COM3/SEG1
COM2/SEG0
COM1
COM0
C2
C1
Y
2.23mm
X