SI5020-BM Silicon Laboratories Inc, SI5020-BM Datasheet - Page 19

IC CLOCK/DATA RECOVERY 20MLP

SI5020-BM

Manufacturer Part Number
SI5020-BM
Description
IC CLOCK/DATA RECOVERY 20MLP
Manufacturer
Silicon Laboratories Inc
Type
Clock and Data Recovery (CDR)r
Datasheets

Specifications of SI5020-BM

Package / Case
20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
Input
Differential
Output
CML
Frequency - Max
2.7GHz
Voltage - Supply
2.375 V ~ 2.625 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Frequency-max
2.7GHz
Product
RF / Wireless
Supply Current
122 mA
Maximum Operating Temperature
85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
336-1128
Package Outline: Si5020-BM
Figure 11 illustrates the package details for the Si5020-BM. Table 10 lists the values for the dimensions shown in
the illustration.
0.50 DIA.
PIN1 ID
Notes:
Symbol
D, E
1. Dimensioning and tolerances conform to ASME Y14.5M. - 1994
2. Package warpage MAX 0.05 mm.
3. “b” applies to plated terminal and is measured between 0.20 and 0.25 mm from terminal TIP.
4. The package weight is approximately 42 mg.
5. The mold compound for this package has a flammability rating of UL94-V0 with an oxygen index of 28
6. The recommended reflow profile for this package is defined by the JEDEC-020B Small Body specification.
A1
A2
A3
A
b
1
2
3
minimum/54 typical.
20
Top View
0.00
0.18
Min
D1
D
Figure 11. 20-pin Micro Leadframe Package (MLP)
Millimeters
0.20 REF.
4.00 BSC
Nom
0.85
0.01
0.65
0.23
E1
Table 10. Package Dimensions
E
Max
0.90
0.05
0.70
0.30
θ
A2
Rev. 1.4
A
Side View
Symbol
b
e
A1
A3
D1, E1
D2, E2
e
L
θ
0.50
1.95
Min
e
L
b
Bottom View
Millimeters
3.75 BSC
0.50 BSC
Nom
2.10
0.60
D2
20
Si5020
Max
2.25
0.75
12°
1
2
3
E2
19

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