ICS85310AYI-11LFT IDT, Integrated Device Technology Inc, ICS85310AYI-11LFT Datasheet - Page 12
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ICS85310AYI-11LFT
Manufacturer Part Number
ICS85310AYI-11LFT
Description
IC FANOUT BUFFER 1-5 DUAL 32LQFP
Manufacturer
IDT, Integrated Device Technology Inc
Series
HiPerClockS™r
Type
Fanout Buffer (Distribution), Multiplexerr
Datasheet
1.ICS85310AYI-11LFT.pdf
(18 pages)
Specifications of ICS85310AYI-11LFT
Number Of Circuits
1
Ratio - Input:output
2:10
Differential - Input:output
Yes/Yes
Input
HCSL, LVDS, LVHSTL, LVPECL, SSTL
Output
ECL, LVPECL
Frequency - Max
700MHz
Voltage - Supply
2.375 V ~ 3.8 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-LQFP
Frequency-max
700MHz
Number Of Clock Inputs
2
Mode Of Operation
Differential
Output Frequency
700MHz
Output Logic Level
ECL/LVPECL
Operating Supply Voltage (min)
-2.375/2.375V
Operating Supply Voltage (typ)
-2.5/-3.3/3.3V
Operating Supply Voltage (max)
-3.8/3.8V
Package Type
LQFP
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
85310AYI-11LFT
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ICS85310AYI-11LFT
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
ICS85310I-11 Data Sheet
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS5311I-01.
Equations and example calculations are also provided.
1.
The total power dissipation for the ICS5311I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Total Power_
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θ
flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (single layer or multi-layer).
Table 6. Thermal Resistance
ICS85310AYI-11 REVISION F JUNE 9, 2010
Linear Feet per Minute
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
Power Dissipation.
•
•
Power (core)
Power (outputs)
If all outputs are loaded, the total power is 10 * 30mW = 300mW
The equation for Tj is as follows: Tj = θ
Tj = Junction Temperature
θ
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
85°C + 0.756W * 42.1°C/W = 116.8°C. This is well below the limit of 125°C.
JA
A
= Ambient Temperature
= Junction-to-Ambient Thermal Resistance
MAX
(3.8V, with all outputs switching) = 456mW + 300mW = 756mW
MAX
MAX
= V
= 30mW/Loaded Output pair
CC_MAX
θ
JA
* I
for 32 Lead LQFP, Forced Convection
EE_MAX
CC
= 3.8V, which gives worst case results.
JA
= 3.8V * 120mA = 456mW
* Pd_total + T
θ
JA
67.8°C/W
47.9°C/W
A
by Velocity
0
LOW SKEW, 1-TO-10 DIFFERENTIAL-TO-3.3V, 2.5V LVPECL/ECL FANOUT BUFFER
12
55.9°C/W
42.1°C/W
200
JA
must be used. Assuming a moderate air
©2010 Integrated Device Technology, Inc.
50.1°C/W
39.4°C/W
500