ICS8543BGI IDT, Integrated Device Technology Inc, ICS8543BGI Datasheet - Page 14

• Manufacturer Part Number: ICS8543BGI
• Description: IC CLK FAN BUFF MUX 1:4 20TSSOP
• Manufacturer: IDT, Integrated Device Technology Inc
• Type: Fanout Buffer (Distribution), Multiplexerr
• Series: HiPerClockS™r

Specifications of ICS8543BGI

• Number Of Circuits: 1
• Ratio - Input:output: 1:4
• Differential - Input:output: Yes/Yes
• Input: CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL
• Output: LVDS
• Frequency - Max: 650MHz
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Frequency-max: 650MHz
• Number Of Clock Inputs: 2
• Mode Of Operation: Differential
• Output Frequency: 650MHz
• Output Logic Level: LVDS
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.465V
• Package Type: TSSOP
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 8543BGI

Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8543I.
Equations and example calculations are also provided.
1.
The total power dissipation for the ICS8543I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θ
and a multi-layer board, the appropriate value is 73.2°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 6. Thermal Resitance
IDT™ / ICS™ LVDS FANOUT BUFFER
Linear Feet per Minute
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
ICS8543I
LOW SKEW, 1-TO-4, DIFFERENTIAL-TO-LVDS FANOUT BUFFER
Power Dissipation.
•
Power (core)
The equation for Tj is as follows: Tj = θ
Tj = Junction Temperature
θ
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
85°C + 0.173W * 73.2°C/W = 97.7°C. This is well below the limit of 125°C.
JA
A
= Ambient Temperature
= Junction-to-Ambient Thermal Resistance
MAX
= V
DD_MAX
θ
JA
for 20 Lead TSSOP, Forced Convection
* I
DD_MAX
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
JA
= 3.465V * 50mA = 173.25mW
* Pd_total + T
θ
114.5°C/W
JA
73.2°C/W
A
by Velocity
0
14
98.0°C/W
66.6°C/W
200
JA
ICS8543BGI REV. E SEPTEMBER 9, 2008
must be used. Assuming no air flow
88.0°C/W
63.5°C/W
500