ADF4154BRUZ Analog Devices Inc, ADF4154BRUZ Datasheet - Page 21

• Manufacturer Part Number: ADF4154BRUZ
• Description: IC FRAC-N FREQ SYNTH 16-TSSOP
• Manufacturer: Analog Devices Inc
• Type: Fractional N Synthesizer (RF)r

Specifications of ADF4154BRUZ

• Pll: Yes
• Input: CMOS
• Output: Clock
• Number Of Circuits: 1
• Ratio - Input:output: 2:1
• Differential - Input:output: Yes/No
• Frequency - Max: 4GHz
• Divider/multiplier: No/Yes
• Voltage - Supply: 2.7 V ~ 3.3 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP
• Frequency-max: 4GHz
• Pll Type: Frequency Synthesis
• Frequency: 4GHz
• Supply Current: 20mA
• Supply Voltage Range: 2.7V To 5.5V
• Digital Ic Case Style: TSSOP
• No. Of Pins: 16
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: EVAL-ADF4154EBZ1 - BOARD EVALUATION FOR ADF4154EB1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PCB DESIGN GUIDELINES FOR CHIP SCALE
PACKAGE
The lands on the chip scale package (CP-20-1) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the
pad. This ensures that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern to avoid shorting.
Rev. A | Page 21 of 24
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias
are used, they should be incorporated into the thermal pad at
1.2 mm pitch grid. The via diameter should be between 0.3 mm
and 0.33 mm, and the via barrel should be plated with 1 oz of
copper to plug the via.
The user should connect the printed circuit board thermal pad
to AGND.
ADF4154