DS32B35-33IND# Maxim Integrated Products, DS32B35-33IND# Datasheet - Page 2

• Manufacturer Part Number: DS32B35-33IND#
• Description: IC RTC W/TCXO 20-SOIC
• Manufacturer: Maxim Integrated Products
• Type: Clock/Calendar/TCXO/Crystal/FRAMr

Specifications of DS32B35-33IND#

• Memory Size: 16K (2K x 8)
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 3.63 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Function: Clock/Calendar
• Rtc Memory Size: 2048 B
• Supply Voltage (max): 3.63 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Rtc Bus Interface: I2C
• Supply Current: 260 uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground......-0.3V to +5.0V
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature ......................................................+125°C
Storage Temperature Range ...............................-40°C to +85°C
Junction-to-Ambient Thermal Resistance (θ
RECOMMENDED OPERATING CONDITIONS
(T
ELECTRICAL CHARACTERISTICS
(V
Accurate I
TCXO/Crystal/FRAM
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Battery Voltage
Input High Voltage
Input Low Voltage
Active Supply Current
Standby Supply Current
Temperature Conversion Current
Power-Fail Voltage
Logic 0 Output
32kHz, INT/SQW, SDA
Logic 0 Output
RST
Output Leakage Current
32kHz, INT/SQW, SDA
Input Leakage
SCL
RST I/O Leakage
WP Input Resistance
A
CC
= -40°C to +85°C, unless otherwise noted.) (Notes 2, 3)
_____________________________________________________________________
= 2.7V to 3.63V, T
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
PARAMETER
A
= -40°C to +85°C, unless otherwise noted.) (Note 2)
2
C RTC with Integrated
SYMBOL
SYMBOL
I
V
I
I
LEAK
V
V
V
V
R
V
CCA
CCS
I
V
I
I
BAT
OL
TC
CC
OL
OL
LI
PF
JA
IH
IN
IL
) (Note 1)....55°C/W
(Note 4)
(Note 5)
V
SCL = 400kHz
(Note 6)
V
32kHz on, SQW off (Note 6)
V
32kHz on, SQW off
I
I
Output high impedance
RST high impedance (Note 7)
V
V
OL
OL
CC
CC
CC
IN
IN
= 3mA
= 1mA
= V
= V
= 3.63V,
= 3.63V, SCL = 0kHz,
= 3.65V, SCL = 0kHz,
IL(MAX)
IH(MIN)
CONDITIONS
CONDITIONS
Accessing RTC
Accessing FRAM
memory
Junction-to-Case Thermal Resistance (θ
Lead Temperature (soldering, 10s) .................................+260°C
Soldering Temperature (reflow, 2x max)..........................+260°C
(See the Handling, PC Board Layout, and Assembly section.)
0.7 x
2.70
2.45
-200
MIN
V
MIN
-0.3
2.3
50
-1
-1
CC
1
2.575
TYP
TYP
3.3
3.0
JC
) (Note 1) ......24°C/W
+0.3 x
V
MAX
MAX
3.63
2.70
+10
V
260
260
110
575
3.6
CC
0.3
0.4
0.4
+1
+1
CC
+
UNITS
UNITS
M
μA
μA
μA
μA
μA
μA
k
V
V
V
V
V
V
V