LTC2220CUP-1#TRPBF Linear Technology, LTC2220CUP-1#TRPBF Datasheet - Page 27
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LTC2220CUP-1#TRPBF
Manufacturer Part Number
LTC2220CUP-1#TRPBF
Description
IC ADC 12BIT 185MSPS 64-QFN
Manufacturer
Linear Technology
Datasheet
1.LTC2220CUP-1TRPBF.pdf
(28 pages)
Specifications of LTC2220CUP-1#TRPBF
Number Of Bits
12
Sampling Rate (per Second)
185M
Data Interface
Parallel
Number Of Converters
1
Power Dissipation (max)
1.18W
Voltage Supply Source
Single Supply
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
64-WFQFN, Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PACKAGE DESCRIPTIO
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 TOP MARK
(SEE NOTE 5)
9 .00 ± 0.10
(4 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50 BSC
0.25 ±0.05
U
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705)
0.70 ±0.05
7.15 ±0.05
(4 SIDES)
PACKAGE OUTLINE
0.75 ± 0.05
UP Package
8.10 ±0.05 9.50 ±0.05
7.15 ± 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
CHAMFER
PIN 1
LTC2220-1
0.50 BSC
0.25 ± 0.05
63
64
(UP64) QFN 1003
27
0.40 ± 0.10
1
2
2220_1fa