AD7714YRUZ Analog Devices Inc, AD7714YRUZ Datasheet - Page 40

IC ADC SIGNAL COND 3/5V 24-TSSOP

AD7714YRUZ

Manufacturer Part Number
AD7714YRUZ
Description
IC ADC SIGNAL COND 3/5V 24-TSSOP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD7714YRUZ

Data Interface
DSP, MICROWIRE™, QSPI™, Serial, SPI™
Number Of Bits
24
Sampling Rate (per Second)
1k
Number Of Converters
1
Power Dissipation (max)
7mW
Voltage Supply Source
Analog and Digital
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
24-TSSOP (0.173", 4.40mm Width)
Resolution (bits)
24bit
Sampling Rate
1kSPS
Input Channel Type
Differential
Supply Voltage Range - Digital
2.7V To 5.25V
Supply Current
1.1mA
Number Of Elements
1
Resolution
24Bit
Architecture
Delta-Sigma
Sample Rate
1KSPS
Input Polarity
Unipolar/Bipolar
Input Type
Voltage
Differential Input
Yes
Power Supply Requirement
Analog and Digital
Single Supply Voltage (typ)
3/5V
Single Supply Voltage (min)
2.7V
Single Supply Voltage (max)
5.25V
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Power Dissipation
4.75mW
Integral Nonlinearity Error
±0.0015%FSR
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
24
Package Type
TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
EVAL-AD7714-3EBZ - BOARD EVALUATION FOR AD7714
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD7714YRUZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
AD7714
0.01 (0.254)
0.006 (0.15)
0.019 (0.41)
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH
2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED
0.02 (0.5)
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
24
24
1
1
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
PIN 1
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
PIN 1
0.05 (1.27)
BSC
0.608 (15.45)
0.596 (15.13)
1.228 (31.19)
1.226 (31.14)
0.016 (2.28)
0.11 (2.79)
24-Lead Wide Body SOIC
0.019 (0.49)
0.014 (0.35)
24-Lead Plastic DIP
0.07 (1.78)
0.05 (1.27)
(R-24)
(N-24)
13
12
0.096 (204)
0.089 (2.26)
SEATING
PLANE
13
12
0.291 (7.39)
0.299 (7.6)
0.260 ± 0.001
(6.61 ± 0.03)
SEATING
PLANE
0.130 (3.30)
0.128 (7.62)
0.013 (0.32)
0.009 (0.23)
0.414 (10.52)
0.398 (10.10)
15
0
0.32 (8.128)
8
0
0.30 (7.62)
Dimensions are shown in inches and (mm).
0.03 (0.76)
0.02 (0.51)
0.011 (0.28)
0.009 (0.23)
OUTLINE DIMENSIONS
0.0500 (1.27)
0.0157 (0.40)
–40–
0.008 (0.203)
0.002 (0.050)
0.006 (0.15)
0.002 (0.05)
SEATING
24-Lead Thin Shrink Small Outline Package TSSOP
PLANE
28
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
1
28-Lead Shrink Small Outline Package SSOP
PIN 1
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24
1
0.0256 (0.65)
PIN 1
BSC
0.0256 (0.65)
0.407 (10.34)
0.397 (10.08)
0.311 (7.90)
0.303 (7.70)
BSC
0.0118 (0.30)
0.0075 (0.19)
SEATING
(RU-24)
(RS-28)
PLANE
13
12
0.066 (1.67)
0.07 (1.79)
14
15
0.0433
(1.10)
MAX
0.205 (5.207)
0.009 (0.229)
0.005 (0.127)
0.212 (5.38)
0.0035 (0.090)
0.0079 (0.20)
0.301 (7.64)
0.311 (7.9)
8
0
8
0
0.022 (0.558)
0.03 (0.762)
0.028 (0.70)
0.020 (0.50)
REV. C

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