AD9271BSVZ-40 Analog Devices Inc, AD9271BSVZ-40 Datasheet - Page 10
AD9271BSVZ-40
Manufacturer Part Number
AD9271BSVZ-40
Description
IC ADC OCT 12BIT 40MSPS 100-TQFP
Manufacturer
Analog Devices Inc
Datasheet
1.AD9271BSVZ-50.pdf
(60 pages)
Specifications of AD9271BSVZ-40
Data Interface
Serial, SPI™
Number Of Bits
12
Sampling Rate (per Second)
40M
Number Of Converters
8
Power Dissipation (max)
1.28W
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
100-TQFP Exposed Pad
Resolution (bits)
12bit
Sampling Rate
50MSPS
Input Channel Type
Differential, Single Ended
Supply Voltage Range - Digital
1.7V To 1.9V
Supply Current
613mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AD9271-50EBZ - BOARD EVALUATION AD9271 50MSPS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
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AD9271
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
ELECTRICAL
ENVIRONMENTAL
AVDD
DRVDD
CWVDD
GND
AVDD
Digital Outputs
CLK+, CLK−
LI-x
LO-x
LOSW-x
CWDx−, CWDx+
SDIO, GAIN+, GAIN−
PDWN, STBY, SCLK, CSB
REFT, REFB, RBIAS
VREF, SENSE
Operating Temperature
Storage Temperature
Maximum Junction
Lead Temperature
(DOUTx+, DOUTx−,
DCO+, DCO−,
FCO+, FCO−)
Range (Ambient)
Range (Ambient)
Temperature
(Soldering, 10 sec)
With
Respect To
GND
GND
GND
GND
DRVDD
GND
GND
LG-x
LG-x
LG-x
GND
GND
GND
GND
GND
−0.3 V to +3.9 V
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−40°C to +85°C
−65°C to +150°C
150°C
300°C
Rev. B | Page 10 of 60
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 5.
Air Flow Velocity (m/s)
0.0
1.0
2.5
1
ESD CAUTION
θ
soldered to PCB.
JA
for a 4-layer PCB with solid ground plane (simulated). Exposed pad
θ
20.3
14.4
12.9
JA
1
θ
7.6
JB
θ
4.7
JC
Unit
°C/W
°C/W
°C/W