X9408YV24-2.7T1 Intersil, X9408YV24-2.7T1 Datasheet - Page 19
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X9408YV24-2.7T1
Manufacturer Part Number
X9408YV24-2.7T1
Description
IC XDCP QUAD 64-TAP 2.5K 24TSSOP
Manufacturer
Intersil
Series
XDCP™r
Datasheet
1.X9408WS24I.pdf
(20 pages)
Specifications of X9408YV24-2.7T1
Taps
64
Resistance (ohms)
2.5K
Number Of Circuits
4
Temperature Coefficient
300 ppm/°C Typical
Memory Type
Non-Volatile
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
24-TSSOP
Resistance In Ohms
2.5K
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Thin Shrink Small Outline Package Family (TSSOP)
C
SEATING
PLANE
N LEADS
E
0.10 C
A
0.25
E1
B
c
A2
M
e
N
1
C A B
A1
SEE DETAIL “X”
TOP VIEW
b
DETAIL X
SIDE VIEW
D
END VIEW
19
L1
(N/2)+1
L
(N/2)
0.10
Plastic Packages for Intergrated Circuits
M
0° - 8°
0.05
PIN #1 I.D.
C A B
2X
N/2 LEAD TIPS
A
GAUGE
PLANE
0.20 C
0.25
B A
H
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
NOTES:
SYMBOL
1. Dimension “D” does not include mold flash, protrusions or gate
2. Dimension “E1” does not include interlead flash or protrusions.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
A1
A2
E1
L1
D
A
b
E
e
L
c
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
14 LD 16 LD 20 LD 24 LD 28 LD
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
MILLIMETERS
1.20
0.10
0.90
0.25
0.15
6.50
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
7.80
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
9.70
6.40
4.40
0.65
0.60
1.00
TOLERANCE
+0.05/-0.06
+0.05/-0.06
January 15, 2009
Reference
Rev. F 2/07
±0.05
±0.05
±0.10
±0.10
±0.15
Basic
Basic
Max
FN8191.4