X9408YV24-2.7T1 Intersil, X9408YV24-2.7T1 Datasheet - Page 2
![IC XDCP QUAD 64-TAP 2.5K 24TSSOP](/photos/6/65/66570/20-24-tssop_sml.jpg)
X9408YV24-2.7T1
Manufacturer Part Number
X9408YV24-2.7T1
Description
IC XDCP QUAD 64-TAP 2.5K 24TSSOP
Manufacturer
Intersil
Series
XDCP™r
Datasheet
1.X9408WS24I.pdf
(20 pages)
Specifications of X9408YV24-2.7T1
Taps
64
Resistance (ohms)
2.5K
Number Of Circuits
4
Temperature Coefficient
300 ppm/°C Typical
Memory Type
Non-Volatile
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
24-TSSOP
Resistance In Ohms
2.5K
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Ordering Information
*Add "T1" suffix for tape and reel. **Add "T1" suffix for tape and reel.Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
X9408YS24*
X9408YS24I*
X9408YV24*
X9408YV24Z* (Note)
X9408YV24I*
X9408YV24IZ* (Note)
X9408WS24*
X9408WS24I*
X9408WV24*
X9408WV24Z* (Note)
X9408WV24I*
X9408WV24IZ* (Note)
X9408YS24-2.7*
X9408YS24I-2.7*
X9408YV24-2.7*
X9408YV24Z-2.7* (Note)
X9408YV24I-2.7*
X9408YV24IZ-2.7T1 (Note) X9408YV Z G
X9408WS24-2.7*
X9408WS24I-2.7*
X9408WS24IZ-2.7* (Note) X9408WS Z G
X9408WV24-2.7*
X9408WV24Z-2.7* (Note)
X9408WV24I-2.7*
X9408WV24IZ-2.7* (Note) X9408WV Z G
PART NUMBER
PART MARKING V
X9408YS
X9408YS I
X9408YV
X9408YV Z
X9408YV I
X9408YV Z I
X9408WS
X9408WS I
X9408WV
X9408WV Z
X9408WV I
X9408WV Z I
X9408YS F
X9408YS G
X9408YV F
X9408YV Z F
X9408YV G
X9408WS F
X9408WS G
X9408WV F
X9408WV Z F
X9408WV G
2
CC
2.7 to 5.5
5 ±10%
LIMITS (V)
POTENTIOMETER
ORGANIZATION
X9408
(kΩ)
2.5
2.5
10
10
TEMP RANGE
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
(°C)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) Tape and Reel
(Pb-Free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-Free)
PACKAGE
January 15, 2009
FN8191.4