AD5428YRUZ Analog Devices Inc, AD5428YRUZ Datasheet - Page 29

• Manufacturer Part Number: AD5428YRUZ
• Description: IC DAC 8BIT DUAL MULT 20TSSOP
• Manufacturer: Analog Devices Inc

Specifications of AD5428YRUZ

• Data Interface: Parallel
• Settling Time: 30ns
• Number Of Bits: 8
• Number Of Converters: 2
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 3.3µW
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Resolution (bits): 8bit
• Sampling Rate: 21.3MSPS
• Input Channel Type: Parallel
• Supply Voltage Range - Analogue: 2.5V To 5.5V
• Supply Current: 500nA
• Digital Ic Case Style: TSSOP
• Package: 20TSSOP
• Resolution: 8 Bit
• Conversion Rate: 21.3 MSPS
• Architecture: R-2R
• Digital Interface Type: Parallel
• Number Of Outputs Per Chip: 2
• Output Type: Current
• Full Scale Error: ±25 mV
• Integral Nonlinearity Error: ±0.25 LSB
• Maximum Settling Time: 0.12 us
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: EVAL-AD5428EBZ - BOARD EVAL FOR AD5428
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

COPLANARITY
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD5428YRU
AD5428YRU-REEL
AD5428YRU-REEL7
AD5428YRUZ
AD5428YRUZ-REEL
AD5428YRUZ-REEL7
AD5440YRU
AD5440YRU-REEL
AD5440YRU-REEL7
AD5440YRUZ
AD5440YRUZ-REEL
AD5440YRUZ-REEL7
AD5447YRU
AD5447YRU-REEL
AD5447YRUZ
AD5447YRUZ-REEL
AD5447YRUZ-REEL7
EVAL-AD5447EBZ
1
Z = RoHS Compliant Part.
0.15
0.05
PIN 1
1
0.10
Figure 51. 20-Lead Thin Shrink Outline Package [TSSOP]
20
1
BSC
0.65
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AC
6.60
6.50
6.40
Dimensions shown in millimeters
1.20 MAX
Resolution
8
8
8
8
8
8
10
10
10
10
12
12
12
12
12
12
12
11
10
SEATING
PLANE
(RU-20)
4.50
4.40
4.30
0.20
0.09
6.40 BSC
INL (LSB)
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±1
±1
±1
±1
±1
±1
±1
8°
0°
Rev. B | Page 29 of 32
0.75
0.60
0.45
Temperature Range
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
–40 °C to +125°C
0.15
0.05
PIN 1
0.10 COPLANARITY
Figure 52. 24-Lead Thin Shrink Small Outline Package [TSSOP]
24
1
COMPLIANT TO JEDEC STANDARDS MO-153-AD
BSC
0.65
Package Description
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
20-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
24-Lead TSSOP
Evaluation Kit
0.30
0.19
7.90
7.80
7.70
Dimensions shown in millimeters
AD5428/AD5440/AD5447
SEATING
PLANE
(RU-24)
13
12
MAX
1.20
4.50
4.40
4.30
0.20
0.09
6.40 BSC
Package Option
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
RU-24
RU-24
RU-24
RU-24
RU-24
RU-24
RU-24
RU-24
RU-24
RU-24
RU-24
8°
0°
0.75
0.60
0.45