BAP64-06W NXP Semiconductors, BAP64-06W Datasheet - Page 2

Two planar PIN diodes in common anode configuration in a SOT323 small SMD plastic package

BAP64-06W

Manufacturer Part Number
BAP64-06W
Description
Two planar PIN diodes in common anode configuration in a SOT323 small SMD plastic package
Manufacturer
NXP Semiconductors
Type
Attenuator/Switchr
Datasheet

Specifications of BAP64-06W

Configuration
Dual Common Anode
Forward Current
100mA
Forward Voltage
1.1V
Power Dissipation
240mW
Operating Temperature Classification
Military
Reverse Voltage
100V
Package Type
SC-70
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Maximum Series Resistance @ Maximum If
1.35@100mAOhm
Typical Carrier Life Time
1.55us
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
3
Applications Frequency Range
SHF
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAP64-06W
Manufacturer:
NXP
Quantity:
72 000
NXP Semiconductors
FEATURES
 High voltage, current controlled
 RF resistor for RF attenuators and switches
 Low diode capacitance
 Low diode forward resistance
 Low series inductance
 For applications up to 3 GHz.
APPLICATIONS
 RF attenuators and switches.
DESCRIPTION
Two planar PIN diodes in common anode configuration in
a SOT323 small SMD plastic package.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
2001 Apr 17
Per diode
V
I
P
T
T
SYMBOL
F
stg
j
R
tot
Silicon PIN diode
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
PARAMETER
T
s
= 90 C
2
PINNING
handbook, halfpage
CONDITIONS
Marking code: V4-.
Fig.1 Simplified outline (SOT323) and symbol.
Top view
PIN
1
1
2
3
3
2
MGU320
65
65
cathode 1
cathode 2
common connection
MIN.
2
Product specification
DESCRIPTION
BAP64-06W
100
100
240
+150
+150
MAX.
3
V
mA
mW
C
C
1
UNIT

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