HI5735KCB Intersil, HI5735KCB Datasheet - Page 10

• Manufacturer Part Number: HI5735KCB
• Description: IC DAC 12-BIT 80MSPS 28-SOIC
• Manufacturer: Intersil

Specifications of HI5735KCB

• Settling Time: 20ns
• Number Of Bits: 12
• Data Interface: Parallel
• Number Of Converters: 1
• Voltage Supply Source: Analog and Digital, Dual ±
• Power Dissipation (max): 650mW
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
Metallization Mask Layout
161.5 mils x 160.7 mils x 19 mils ±1 mil
Type: AlSiCu
Thickness: M1 - 8k
D7
D6
D5
D4
D3
D2
D1
Å
, M2 - 17k
10
D0
D8
Å
D9
D10
D11
HI5735
HI5735
CLK
PASSIVATION:
DIE ATTACH:
SUBSTRATE POTENTIAL (POWERED UP):
DGND
DV
Silver Filled Epoxy
V
CC
EED
Type: Sandwich Passivation Undoped Silicon Glass
Thickness: USG - 8k
Total 12.2k
(USG) + Nitride
DGND
Å
± +2k
DV
EE
Å
Å
, Nitride - 4.2k
CTRL OUT
CTRL IN
R
AV
I
I
ARTN
OUT
OUT
SET
EE
Å