HI5735KCB Intersil, HI5735KCB Datasheet - Page 3

• Manufacturer Part Number: HI5735KCB
• Description: IC DAC 12-BIT 80MSPS 28-SOIC
• Manufacturer: Intersil

Specifications of HI5735KCB

• Settling Time: 20ns
• Number Of Bits: 12
• Data Interface: Parallel
• Number Of Converters: 1
• Voltage Supply Source: Analog and Digital, Dual ±
• Power Dissipation (max): 650mW
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Absolute Maximum Ratings
Digital Supply Voltage V
Negative Digital Supply Voltage DV
Negative Analog Supply Voltage AV
Digital Input Voltages (D11-D0, CLK) to DGND. . . . . DV
Internal Reference Output Current. . . . . . . . . . . . . . . . . . . . ±2.5mA
Voltage from CTRL IN to AV
Control Amplifier Output Current . . . . . . . . . . . . . . . . . . . . . ±2.5mA
Reference Input Voltage Range . . . . . . . . . . . . . . . . . .-3.7V to AV
Analog Output Current (I
Operating Conditions
Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
SYSTEM PERFORMANCE
Resolution
Integral Linearity Error, INL
Differential Linearity Error, DNL
Offset Error, I
Full Scale Gain Error, FSE
Offset Drift Coefficient
Full Scale Output Current, I
Output Voltage Compliance Range
DYNAMIC CHARACTERISTICS
Throughput Rate
Output Voltage Full Scale Step
Settling Time, t
Single Glitch Area, GE (Peak)
Doublet Glitch Area, (Net)
Output Slew Rate
Output Rise Time
Output Fall Time
Differential Gain
Differential Phase
Spurious Free Dynamic Range to Nyquist
(Note 3)
1. θ
HI5735KCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
JA
is measured with the component mounted on an evaluation PC board in free air.
OS
SETT
PARAMETER
Full Scale
CC
OUT
to DGND . . . . . . . . . . . . . . . . . . . +5.5V
EE
FS
) . . . . . . . . . . . . . . . . . . . . . . . . . 30mA
. . . . . . . . . . . . . . . . . . . . 2.5V to 0V
3
EE
EE
AV
to DGND . . . . . . . . . . -5.5V
EE
to AGND, ARTN . . . . . -5.5V
, DV
EE
= -4.94 to -5.46V, V
(Note 4) (“Best Fit” Straight Line)
(Note 4)
(Note 4)
(Notes 2, 4)
(Note 3)
(Note 3)
(Note 5)
To ±0.5 LSB Error Band R
(Note 3)
R
R
(Note 3)
R
(Note 3)
R
(Note 3)
R
R
f
f
CLK
CLK
L
L
L
L
L
L
CC
o
C to 70
= 50Ω (Note 3)
= 50Ω, DAC Operating in Latched Mode
= 50Ω, DAC Operating in Latched Mode
= 50Ω, DAC Operating in Latched Mode
= 50Ω (Note 3)
= 50Ω (Note 3)
= 40MHz, f
= 80MHz, f
to -0.5V
EE
o
C
HI5735
CC
TEST CONDITIONS
OUT
OUT
= +4.75 to +5.25V, V
= 2.02MHz, 20MHz Span
= 2.02MHz, 40MHz Span
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Junction Temperature
Maximum Storage Temperature Range . . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
Plastic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150
(SOIC - Lead Tips Only)
L
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . .
= 50Ω
REF
= Internal T
A
-1.25
= 25
MIN
12
80
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
o
C for All Typical Values
20.48
1,000
TYP
0.75
0.15
0.07
675
470
0.5
20
20
70
70
1
5
3
-
-
-
-
MAX
0.05
1.5
1.0
75
10
0
-
-
-
-
-
-
-
-
-
-
-
-
-
o
θ
C to 150
JA
UNITS
µA/
MSPS
pV-s
pV-s
V/µs
LSB
LSB
Deg
(
Bits
dBc
dBc
75
mA
µA
o
ns
ps
ps
%
%
V
C/W)
o
C
o
o
o
C
C
C