MT41J256M8DA-125:H Micron Technology Inc, MT41J256M8DA-125:H Datasheet - Page 28

• Manufacturer Part Number: MT41J256M8DA-125:H
• Manufacturer: Micron Technology Inc

Specifications of MT41J256M8DA-125:H

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Figure 12: 96-Ball FBGA – x16; "HA"
Solder ball
material: SAC305.
Dimensions
apply to solder
balls post-reflow
on Ø0.35 SMD
ball pads.
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
Seating
12 CTR
plane
96X Ø0.45
0.12 A
0.8 TYP
A
9 8 7
Note:
0.8 TYP
6.4 CTR
9 ±0.15
1. All dimensions are in millimeters.
3 2 1
0.8 ±0.1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Ball A1 ID
14 ±0.15
28
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
2Gb: x4, x8, x16 DDR3 SDRAM
1.2 MAX
Package Dimensions
© 2006 Micron Technology, Inc. All rights reserved.
Ball A1 ID