MT47H32M16BN-3 IT:D Micron Technology Inc, MT47H32M16BN-3 IT:D Datasheet - Page 20

• Manufacturer Part Number: MT47H32M16BN-3 IT:D
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16BN-3 IT:D

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 250mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Packaging
Package Dimensions
Figure 8: 84-Ball FBGA (12mm x 12.5mm) – x16
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
Seating
11.2
plane
0.12 C
Solder ball
diameter refers
to post-reflow
condition.
84X Ø0.45
C
Note:
12.0 ±0.15
1. All dimensions are in millimeters.
6.4
C L
TYP
0.8
C L
0.80 TYP
0.8 ±0.1
Ball A1 ID
20
12.5 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.2 MAX
512Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
Ball A1 ID location
© 2004 Micron Technology, Inc. All rights reserved.
Packaging