MT47H32M16BN-3 IT:D Micron Technology Inc, MT47H32M16BN-3 IT:D Datasheet - Page 21
![no-image](/images/manufacturer_photos/0/4/441/micron_technology_inc_sml.jpg)
MT47H32M16BN-3 IT:D
Manufacturer Part Number
MT47H32M16BN-3 IT:D
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H32M16BN-3_ITD.pdf
(139 pages)
Specifications of MT47H32M16BN-3 IT:D
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
250mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
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Figure 9: 84-Ball FBGA (10mm x 12.5mm) – x16
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
Seating plane
Solder ball diameter
refers to post reflow
condition.
0.12 C
84X Ø0.45
11.2
C
Note:
1. All dimensions are in millimeters.
10.0 ±0.15
TYP
6.4
0.8
C L
C L
0.8 TYP
Ball A1 ID
0.8 ±0.1
21
12.5 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.20 MAX
512Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID location
Packaging
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