MT47H32M16BN-3 IT:D Micron Technology Inc, MT47H32M16BN-3 IT:D Datasheet - Page 22

• Manufacturer Part Number: MT47H32M16BN-3 IT:D
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16BN-3 IT:D

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 250mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Figure 10: 84-Ball FBGA (8mm x 12.5mm) – x16
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.33
NSMD ball pads.
84X Ø0.45
11.2 CTR
Seating
plane
0.12 A
Note:
0.8 TYP
0.8 TYP
A
1. All dimensions are in millimeters.
9
8
7
6.4 CTR
8 ±0.15
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.8 ±0.1
22
Exposed
gold-plated pad
1.0mm (MAX) X
0.7mm (NOM)
nonconductive floating pad
12.5 ±0.15
Ball A1 ID
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
1.2 MAX
0.25 MIN
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging